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Silicon Errata
SPRZ193NJanuary 2003Revised November 2015
TMS320F281x, TMS320C281x Silicon Errata
1 Introduction
This document describes the silicon updates to the functional specifications for the TMS320F2810,
TMS320F2811, TMS320F2812, TMS320C2810, TMS320C2811, and TMS320C2812 digital signal
processors (DSPs).
The updates are applicable to:
128-pin Low-Profile Quad Flatpack (LQFP) [PBK suffix]
176-pin LQFP [PGF suffix]
179-ball MicroStar BGA [GHH suffix]
179-ball lead-free MicroStar BGA [ZHH suffix]
2 Device and Development Tool Support Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
[TMS320] DSP devices and support tools. Each TMS320™ DSP commercial family member has one of
three prefixes: TMX, TMP, or TMS (for example, TMS320F2812). Texas Instruments recommends two of
three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent
evolutionary stages of product development from engineering prototypes (TMX/TMDX) through fully
qualified production devices/tools (TMS/TMDS).
TMX Experimental device that is not necessarily representative of the final device's electrical
specifications
TMP Final silicon die that conforms to the device's electrical specifications but has not
completed quality and reliability verification
TMS Fully qualified production device
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal
qualification testing
TMDS Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, GHH) and temperature range (for example, A).
MicroStar BGA, TMS320 are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
4
TMS320F281x, TMS320C281x Silicon Errata SPRZ193NJanuary 2003Revised November 2015
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Copyright © 2003–2015, Texas Instruments Incorporated

TMS320F2812GHHQ 数据手册

TI(德州仪器)
39 页 / 1.25 MByte
TI(德州仪器)
172 页 / 1.67 MByte
TI(德州仪器)
31 页 / 0.2 MByte
TI(德州仪器)
3 页 / 0.42 MByte
TI(德州仪器)
1 页 / 0.05 MByte

TMS320F2812 数据手册

TI(德州仪器)
TEXAS INSTRUMENTS  TMS320F2812PGFA  芯片, 数字信号处理器 150MHz SMD
TI(德州仪器)
TEXAS INSTRUMENTS  TMS320F2812GHHA  芯片, 数字信号处理/控制器 带闪存, 32位
TI(德州仪器)
TEXAS INSTRUMENTS  TMS320F2812PGFQ  芯片, 数字信号处理/控制器 带闪存, 32位
TI(德州仪器)
TEXAS INSTRUMENTS  TMS320F2812PGFS  芯片, 数字信号处理器 32位 带128x16kb闪存
TI(德州仪器)
TEXAS INSTRUMENTS  TMS320F2812ZHHA  芯片, 数字信号控制器, 32位, 256K闪存, C28X, 179BGA
TI(德州仪器)
TEXAS INSTRUMENTS  TMS320F2812GHHS  芯片, 数字信号处理器, 32位, 150MHZ, BGA-179
TI(德州仪器)
TEXAS INSTRUMENTS  TMS320F2812ZHHS  芯片, 数字信号控制器, 32位, 128K闪存, 179BGA
TI(德州仪器)
数字信号处理器 Digital Signal Processors
TI(德州仪器)
TEXAS INSTRUMENTS  TMS320F2812GHHQ  芯片, 数字信号处理器, 32位, 16K闪存, 179-BGA
TI(德州仪器)
具有 150MHz 频率、256KB 闪存、EMIF 的 C2000™ 32 位 MCU 176-LQFP -40 to 85
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