Datasheet 搜索 > 微控制器 > TI（德州仪器） > TMS320F28234PTPQ 数据手册 > TMS320F28234PTPQ 其他数据使用手册 1/5 页
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TMS320F28234PTPQ 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
微控制器
封装:
LQFP-176
描述:
具有 150MIPS、256KB 闪存、EMIF、12 位 ADC 的 C2000™ 32 位 MCU 176-HLQFP -40 to 125
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TMS320F28234PTPQ数据手册
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Texas Instruments, Inc. PCN#20140721003
PCN Number:
20140721003
PCN Date:
07/29/2014
Title:
Qualification of new BOM for select devices in QFP package
Customer Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality
Services
Proposed 1
st
Ship Date:
01/29/2015
Estimated Sample Availability:
Date provided
upon request
Change Type:
Assembly Process
Assembly Materials
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of a new material set for the 3 groups
of devices listed below:
Group A will be converted to Cu wire only.
Group B will be converted to Cu wire as well as a new mold and mount compound.
Group C will be converted to Cu wire as well as a new mold compound.
Change Group# A
Current
New
Bond Wire/Diameter
Au, 1.0 mil
Cu, 0.8 mil
Change Group# B
Current
New
Mold Compound
4205442
4073520
4211649
Mount Compound
4042504
4208458
Bond Wire/Diameter
Au, 0.96 mil
Cu, 0.8 mil
Change Group# C
Current
New
Mold Compound
4205442
4073520
4211649
Bond Wire/Diameter
Au, 0.96 mil
Cu, 0.8 mil
Reason for Change:
Continuity of Supply.
1) To align with world technology trends and use wiring with enhanced mechanical and
electrical properties.
2) Maximize flexibility within our Assembly/Test production sites
3) Copper wire is easier to obtain and stock.
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
Not Applicable
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