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TPS40055PWP
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TPS40054
,
TPS40055
,
TPS40057
SLUS593I DECEMBER 2003REVISED DECEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range unless otherwise noted
(1)
UNI
MIN MAX
T
VFB, SS/SD, SYNC –0.3 6
VIN, SW –0.3 45
V
IN
Input voltage SW, transient < 50 ns –2.5
SW, transient < 50 ns, V
VIN
< 14 V –5.0
KFF, with I
IN(max)
= 5 mA –0.3 11
COMP, RT, SS/SD –0.3 6
V
O
Output voltage
KFF 5 mA
I
O
Output current RT 200 µA
T
J
Maximum junction temperature
(2)
150
°C
T
J
Operating junction temperature –40 125
T
stg
Storage temperature range –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Device may shut down at junction temperatures below 150°C.
6.2 Recommended Operating Conditions
MIN MAX UNIT
V
IN
Input voltage 8 40 V
T
A
Operating free-air temperature –40 85 °C
6.3 Thermal Information
TPS4005x
THERMAL METRIC
(1)
HTSSOP UNIT
16 PINS
R
θJA
Junction-to-ambient thermal resistance 38.3
R
θJCtop
Junction-to-case (top) thermal resistance 28
R
θJB
Junction-to-board thermal resistance 9
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4
ψ
JB
Junction-to-board characterization parameter 8.9
R
θJCbot
Junction-to-case (bottom) thermal resistance 2.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4 Submit Documentation Feedback Copyright © 2003–2014, Texas Instruments Incorporated
Product Folder Links: TPS40054 TPS40055 TPS40057
TPS40054: Not Recommended For New Designs

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