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4
TPS40054
,
TPS40055
,
TPS40057
ZHCSAK8I DECEMBER 2003REVISED DECEMBER 2014
www.ti.com.cn
版权 © 2003–2014, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Device may shut down at junction temperatures below 150°C.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range unless otherwise noted
(1)
MIN MAX
UNI
T
V
IN
Input voltage
VFB, SS/SD, SYNC –0.3 6
VIN, SW –0.3 45
SW, transient < 50 ns –2.5
SW, transient < 50 ns, V
VIN
< 14 V –5.0
KFF, with I
IN(max)
= 5 mA –0.3 11
V
O
Output voltage
COMP, RT, SS/SD –0.3 6
KFF 5 mA
I
O
Output current RT 200 µA
T
J
Maximum junction temperature
(2)
150
°C
T
J
Operating junction temperature –40 125
T
stg
Storage temperature range –55 150 °C
6.2 Recommended Operating Conditions
MIN MAX UNIT
V
IN
Input voltage 8 40 V
T
A
Operating free-air temperature –40 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.3 Thermal Information
THERMAL METRIC
(1)
TPS4005x
UNITHTSSOP
16 PINS
R
θJA
Junction-to-ambient thermal resistance 38.3
°C/W
R
θJCtop
Junction-to-case (top) thermal resistance 28
R
θJB
Junction-to-board thermal resistance 9
ψ
JT
Junction-to-top characterization parameter 0.4
ψ
JB
Junction-to-board characterization parameter 8.9
R
θJCbot
Junction-to-case (bottom) thermal resistance 2.9

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