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TPS54610PWPG4
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TPS54610PWPG4数据手册
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Texas Instruments Incorporated PCN# 20120418001D
PCN Number:
PCN20120418001D
PCN Date:
Jan 13, 2017
Title:
Transfer of select devices in the LBC4 process node to CFAB Facility
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
April 2013
Estimated Sample
Availability:
Samples support is
currently being coordinated.
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
The purpose of PCN Revision D is to announce the retraction of select devices. Retracted
devices are identified with a strikethrough and are highlighted in yellow in the Product Affected
Section. These devices will remain at the current Fab Site.
This change notification is to announce the transfer of select devices in the LBC4 process node
from HFAB and HIJI to the CFAB (Chengdu, China) facility. These devices are listed in “Product
Affected” section.
Current
New
Sites, Process, Wafer Diameter
Site, Process, Wafer Diameter
HFAB/HIJI/HU-BUMP, LBC4, 150mm
CFAB/Clark-Bump/DBUMP, LBC4, 200mm
Device Groups in Product Affected Section
Group 1: Devices with Fab Transfer and Bump site change to Clark-Bump/DBUMP
Group 2: Devices with Fab Transfer Only
*Proposed 1
st
Ship Date is based on current Qual Schedule.
Bump sites were previously qualified. Reference quals are provided in the Qual Data Section.
Reason for Change:
Continuity of Supply. HIJI/HFAB site shutdown.
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
Current
Chip Site
Chip site code (20L)
Chip country code (21L)
HU-BIP-4
HOU
USA
HIJI
HIJ
JPN
New
Chip Site
Chip site code
(20L)
Chip country code
(21L)
CFAB
CU3
CHN

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