Datasheet 搜索 > 接口芯片 > TI（德州仪器） > TS3A5018PWRG4 数据手册 > TS3A5018PWRG4 其他数据使用手册 2/62 页
器件3D模型￥ 3.854
TS3A5018PWRG4 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
接口芯片
封装:
TSSOP-16
描述:
10-I © QUAD SPDT模拟开关 10-Ω QUAD SPDT ANALOG SWITCH
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P33
原理图在P18P33
封装尺寸在P52P54P55P59
焊盘布局在P60
标记信息在P52
封装信息在P52P53P54P55
技术参数、封装参数在P4
电气规格在P6P7P8
型号编号列表在P4
导航目录
TS3A5018PWRG4数据手册
Page:
of 62 Go
若手册格式错乱，请下载阅览PDF原文件
TS3A227E
ZHCSD70B –NOVEMBER 2014–REVISED FEBRUARY 2015
www.ti.com.cn
目目录录
9.2 Functional Block Diagram....................................... 18
1 特特性性.......................................................................... 1
9.3 Feature Description................................................. 19
2 应应用用范范围围................................................................... 1
9.4 Device Functional Modes........................................ 20
3 说说明明.......................................................................... 1
9.5 Register Maps ........................................................ 24
4 简简化化电电路路原原理理图图........................................................ 1
9.6 Register Field Descriptions..................................... 24
5 修修订订历历史史记记录录 ........................................................... 2
10 Application and Implementation........................ 33
6 Pin Configuration and Functions......................... 3
10.1 Application Information.......................................... 33
7 Specifications......................................................... 4
10.2 Typical Application ............................................... 33
7.1 Absolute Maximum Ratings ...................................... 4
11 Power Supply Recommendations ..................... 47
7.2 ESD Ratings ............................................................ 4
12 Layout................................................................... 48
7.3 Recommended Operating Conditions....................... 5
12.1 Layout Guidelines ................................................. 48
7.4 Thermal Information.................................................. 5
12.2 Layout Example (QFN) ......................................... 48
7.5 Electrical Characteristics........................................... 6
12.3 Layout Example (DSBGA) .................................... 49
7.6 I
2
C Interface Timing Characteristics ......................... 8
13 器器件件和和文文档档支支持持 ..................................................... 50
7.7 Timing Diagrams....................................................... 9
13.1 商标 ....................................................................... 50
7.8 Typical Characteristics............................................ 12
13.2 静电放电警告......................................................... 50
8 Parameter Measurement Information ................ 12
13.3 术语表 ................................................................... 50
9 Detailed Description............................................ 17
14 机机械械封封装装和和可可订订购购信信息息 .......................................... 50
9.1 Overview................................................................. 17
5 修修订订历历史史记记录录
Changes from Revision A (December 2014) to Revision B Page
• Added DSBGA package to the Thermal Information table. ................................................................................................... 5
• Updated SWITCH RESISTANCE for the DSBGA package. ................................................................................................. 6
Changes from Original (July 2014) to Revision A Page
• 最初发布的完整版文档。 ....................................................................................................................................................... 1
2 Copyright © 2014–2015, Texas Instruments Incorporated
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
