Datasheet 搜索 > 模拟开关芯片 > TI（德州仪器） > TS3USB30EDGSR 数据手册 > TS3USB30EDGSR 其他数据使用手册 1/9 页
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TS3USB30EDGSR 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
模拟开关芯片
封装:
VSSOP-10
描述:
TEXAS INSTRUMENTS TS3USB30EDGSR 芯片, USB开关, 单路, 1X2, 10MSOP
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TS3USB30EDGSR数据手册
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Texas Instruments, Inc. PCN# 20130624000C
PCN Number:
20130624000C
PCN Date:
09/24/2014
Title:
Add Cu as Alternative Wire Base Metal for Selected Device(s) on SOT23 (DBV) and VSSOP
(DGK, DGS, DGQ) packages
Customer
Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality Services
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Revision C is to make correction on the following:
(a) Remove select devices in the Product Affected Section Group 2 (with strikethrough) and
highlighted in yellow. These devices were inadvertently added and not affected by this change.
Devices with strikethrough and not highlighted in yellow have been retracted earlier under rev B.
Devices in the Product Affected Section (with strikethrough) and no highlight were retracted under
Revision A of this PCN.
Texas Instruments is pleased to announce the qualification of Cu as an additional bond wire option
for devices listed in “Product affected” section below. Devices will remain in current assembly facility
and Material differences are shown in the following table:
Group 1 – Devices that will have Au wire to Cu wire change only
Group 2 – Devices that will have the following change
From
To
Wire
Au
Cu
Mold Compound
R-13
R-17
Leadframe Finish
NiPdAu
Matte Sn
Upon expiration of this PCN, devices in Group 2 (package code DBV), TI will combine lead free
solutions in a single standard part number, for example; HPA00283DBVR – can ship with both
Matte Sn and NiPdAu.
Reason for Change:
Continuity of supply.
1) To align with world technology trends and use wiring with enhanced mechanical and
electrical properties
2) Maximize flexibility within our Assembly/Test production sites.
3) Cu is easier to obtain and stock
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None.
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