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UA78M33CKCSE3 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
TO-220-3
描述:
正电压稳压器 POSITIVE-VOLTAGE REGULATORS
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P4
导航目录
UA78M33CKCSE3数据手册
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Texas Instruments, Inc. PCN# 20150603000
PCN Number:
20150603000
PCN Date:
06/08/2015
Title:
Qualification of GTBF as Additional Assembly/Test Site for Select Devices
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
09/08/2015
Estimated Sample
Availability:
Date Provided at
Sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Qualification of GTBF as additional assembly and test site for Select Devices. Assembly differences
are shown in the following table:
Group 1 Device:
NFME
GTBF
Mount Compound
SID# MC-05
SID# EY0000006
Mold Compound
SID# R-12
SID# EN0000038
Group 2 Device:
NFME
GTBF
Mount Compound
SID# MC-05
SID# EY0000006
Mold Compound
SID# R-12
SID# EN0000038
Wire type
Au
Cu
Test coverage, insertions, conditions will remain consistent with current testing and verified with
test MQ.
Reason for Change:
Continuity of Supply
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
Assembly Site
NFME
Assembly Site Origin (22L)
ASO: NFM
GTBF (Great Team Backend Foundry)
Assembly Site Origin (22L)
ASO: GTF
Sample product shipping label (not actual product label)
ASSEMBLY SITE CODES: NFME = E, GTBF = TBD
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