Datasheet 搜索 > 存储芯片 > Winbond Electronics（华邦电子股份） > W25Q64CVSFIG 数据手册 > W25Q64CVSFIG 其他数据使用手册 2/82 页
器件3D模型￥ 3.883
W25Q64CVSFIG 其他数据使用手册 - Winbond Electronics（华邦电子股份）
制造商:
Winbond Electronics（华邦电子股份）
分类:
存储芯片
封装:
SOIC-16
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P6P7Hot
原理图在P9
型号编码规则在P80
标记信息在P81
封装信息在P5P77P80
功能描述在P5P10
技术参数、封装参数在P68
应用领域在P12
电气规格在P27P28P30P31P62P68P70P72P73
型号编号列表在P81
导航目录
W25Q64CVSFIG数据手册
Page:
of 82 Go
若手册格式错乱，请下载阅览PDF原文件
W25Q32DW
- 2 -
Table of Contents
1. GENERAL DESCRIPTION ............................................................................................................... 5
2. FEATURES ....................................................................................................................................... 5
3. PIN CONFIGURATION SOIC 208-MIL ............................................................................................. 6
4. PAD CONFIGURATION WSON 6X5-MM / 8X6-MM ........................................................................ 6
5. PIN DESCRIPTION SOIC 208-MIL, WSON 6X5/8X6-MM ............................................................... 6
6. PIN CONFIGURATION SOIC 300-MIL ............................................................................................. 7
7. PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 7
7.1 Package Types ..................................................................................................................... 8
7.2 Chip Select (/CS) .................................................................................................................. 8
7.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 8
7.4 Write Protect (/WP) .............................................................................................................. 8
7.5 HOLD (/HOLD) ..................................................................................................................... 8
7.6 Serial Clock (CLK) ................................................................................................................ 8
8. BLOCK DIAGRAM ............................................................................................................................ 9
9. FUNCTIONAL DESCRIPTION ....................................................................................................... 10
9.1 SPI/QPI OPERATIONS ...................................................................................................... 10
9.1.1 Standard SPI Instructions ..................................................................................................... 10
9.1.2 Dual SPI Instructions ............................................................................................................ 10
9.1.3 Quad SPI Instructions ........................................................................................................... 11
9.1.4 QPI Instructions .................................................................................................................... 11
9.1.5 Hold Function ....................................................................................................................... 11
9.2 WRITE PROTECTION ....................................................................................................... 12
9.2.1 Write Protect Features ......................................................................................................... 12
10. CONTROL AND STATUS REGISTERS ......................................................................................... 13
10.1 STATUS REGISTER .......................................................................................................... 13
10.1.1 BUSY .................................................................................................................................. 13
10.1.2 Write Enable Latch (WEL) .................................................................................................. 13
10.1.3 Block Protect Bits (BP2, BP1, BP0) .................................................................................... 13
10.1.4 Top/Bottom Block Protect (TB) ........................................................................................... 13
10.1.5 Sector/Block Protect (SEC) ................................................................................................ 13
10.1.6 Complement Protect (CMP) ................................................................................................ 14
10.1.7 Status Register Protect (SRP1, SRP0) ............................................................................... 14
10.1.8 Erase/Program Suspend Status (SUS) .............................................................................. 14
10.1.9 Security Register Lock Bits (LB3, LB2, LB1, LB0) .............................................................. 14
10.1.10 Quad Enable (QE) ............................................................................................................ 15
10.1.11 W25Q32DW Status Register Memory Protection (CMP = 0) ........................................... 16
10.1.12 W25Q32DW Status Register Memory Protection (CMP = 1) ........................................... 17
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
