Datasheet 搜索 > 存储芯片 > Winbond Electronics（华邦电子股份） > W25Q64FVSFIG TR 数据手册 > W25Q64FVSFIG TR 其他数据使用手册 1/5 页
器件3D模型￥ 7.417
W25Q64FVSFIG TR 其他数据使用手册 - Winbond Electronics（华邦电子股份）
制造商:
Winbond Electronics（华邦电子股份）
分类:
存储芯片
封装:
SOIC-16
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
功能描述在P1P5
导航目录
W25Q64FVSFIG TR数据手册
Page:
of 5 Go
若手册格式错乱，请下载阅览PDF原文件
The above information is the exclusive intellectual property of Winbond Electronics and shall not be disclosed, distributed or reproduced without permission from Winbond.
Table No.: 1110-0001-08-A
Product / Process Change Notice
No.: Z200-PCN-DM201612-01-A Date: 12/12/2016
Change Title : W25Q64JV “J-Series” (58nm) to replace W25Q64FV “F-Series” (58nm) 64Mb 3.3V SpiFlash®
Memories
Change Classification: Major Minor
Change item : Design Raw Material Wafer FAB Assembly Packing Testing Others
Affected Product(s) :
Please refer to Table 1 in details.
Description of Change(s)
The W25Q64JV 64Mb SpiFlash® Memories use Winbond’s 58nm Flash technology. It is function-compatible with
W25Q64FV 58nm devices offering improved performance, features and availability.
Reason for Change(s) :
Improve features and Command backward compatible with W25Q64FV (same Superset Instruction Set), please refer
the attachment I of comparation table.
Impact of Change(s) : ( positive & negative )
Form : No Change
Fit : No Change
Function : No Concern (refer to attachment I)
Reliability : No Concern (refer to attachment II)
Hazardous Substances: No Concern (refer to attachment III)
Qualification Plan/ Results :
Based on Winbond W25Q64JV Serial Flash Reliability report, the new product meets our criteria and no quality
concern (refer to Attachment II in details)
Implementation Plan :
Refer to Attachment IV in details.
Date Code: onward Lot No: onward Proposed first ship date: Please refer to attachment file
Originator: (QA)
Approval: (QA
Dept. Manager)
Approval: (QRA
Director)
Contact for Questions
& Concerns
Name: Betty Huang TEL:886-3-5678168 (ext.86549) FAX: 886-3-5796124
Address : # 539, Sec. 2, Wenxing Rd., Jhubei City, Hsinchu County 302, Taiwan
E-mail: Hyhuang8@winbond.com
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
