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W25X80VSFIG 其他数据使用手册 - Winbond Electronics（华邦电子股份）
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W25X80VSFIG数据手册
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The above information is the exclusive intellectual property of Winbond Electronics and shall not be disclosed, distributed or reproduced without permission from Winbond.
Table No.: 1110-0001-08-A
Product / Process Change Notice
No.: Z200-PCN-OM201605-01-A Date: 05/03/2016
Change Title : To add a new desiccant supplier TAI-CHIANG for all products.
Change Classification: Major Minor
Change item : Design Raw Material Wafer FAB Package Assembly Testing Others
Affected Product(s) :
Please refer to Table 1 in details.
Description of Change(s)
To add a new desiccant supplier TAI-CHIANG.
Reason for Change(s) :
Add 2nd supplier to meet customer delivery requesement.
Impact of Change(s) : ( positive & negative )
Form : No Change
Fit : No Change
Function : No Change
Reliability : No Concern
Hazardous Substances: No Concern (Please refer to attachment III/IV/V/VI)
Qualification Plan/ Results :
1. TAI-CHIANG is an ISO9001 certified company (refer to Attachment II)
2. Based on Winbond standard qualification result, the TAI-CHIANG new desiccant meets our criteria.(Please refer to
attachment in details)
Implementation Plan :
1. Winbond will schedule to ship package with this new desiccant from Sep 1, 2016.
2. The old type of materials, which already packed before, will also be shipped out till use up unless special request.
Date Code: onward Lot No: onward Proposed first ship date: 09/01/2016
Originator: (QA
Sec. Manager)
Approval: (QA
Dept. Manager)
Approval: (QRA
Director)
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