XC2S50-5FG256C 产品修订记录 - Xilinx（赛灵思）

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XCN15028 (v1.0) June 1, 2015 www.xilinx.com 1

The purpose of this notification is to communicate that Xilinx is adding an additional qualified assembly supplier for

indicator from mold ejector to laser mark and the molding cavity angle of package to be vertical as shown on

Figure 1 and Figure 2. SPIL is a qualified assembly supplier for all other Xilinx’s wire bond products.

In addition, both FG(G)256 and FG(G)324 packages from the new supplier meet Xilinx’s design rule, and are

within Xilinx’s package outline drawing. Only total package thickness has a minor change compared with current

supplier as shown in Table 1.

Figure 1 and Figure 2: Comparison of QFG32 and QFG48 package outline

Current indicator by ejector New indicator by laser mark

Figure 2: Top view of QFG32 and QFG48 packages for indicator & outline