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XC6SLX150T-3CSG484C 产品修订记录 - Xilinx（赛灵思）
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Xilinx（赛灵思）
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FPGA芯片
封装:
FBGA-484
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XC6SLX150T 3CSG484C 磨码
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© Copyright 2012-2013 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included herein are
trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners.
XCN12023 (v1.0.1) January 25, 2013 www.xilinx.com 1
Pin Gate Mold Implementation
For FG(G) and BG(G) Wire Bond
Packages
XCN12023 (v1.0.1) January 25, 2013
Product Change Notice – For Information Only
Overview
The purpose of this notification is to communicate that Xilinx is transitioning to pin gate mold (PGM) in plastic ball
grid array FG(G) and BG(G) packages. Xilinx’s Assembly Suppliers are transitioning by the end of Jan, 2014.
This notification applies to all XC Commercial (C) and Industrial (I) grade FPGA products.
Description
Xilinx’s Assembly Suppliers are transitioning from corner gate mold to pin gate mold for FG(G) and BG(G)
packages. Suppliers are converting mature PBGA devices to PGM for improved productivity. PGM process is
designed with the JEDEC compliant larger mold cap still meeting Xilinx’s outer package dimensions.
In addition:
1. Minor Change in the Marking Template: PGM ejector pin will move to the center of the package while
CGM ejector pin remains at the pin 1 indicator location. The new marking template with PGM & CGM will
be applied to all of BG(G)256, FG(G)320, FG(G)400, FG(G)456, FG(G)484 and FG(G)676 devices
packages as shown in Figure 1.
2. Shipping Tray: change in the shipping tray for the 23mmx23mm PBGA packages. The new 23mmx23mm
PBGA Daewon tray matrices are designed to be compatible with the current shipping trays, and will have
the same X/Y tray dimensions. However, the new 23mmx23mm Daewon trays are non-stackable with
current tray due to a slip lock feature. The new trays have larger cavity pocket at bottom of cell cavity
that’s designed for CGM and PGM (larger mold body). Xilinx recommends that customers not stack or
mix the new Daewon trays with the current shipping trays. Please reference Table 2 and Figure 2 for
clarification.
These changes have no effect on form, fit, function or reliability.
Products Affected
This change affects all standard and specification control document (SCD) XC Commercial (C) and Industrial (I)
grade devices listed in Table 1.
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