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AD8045ACPZ-R2 产品设计参考手册 - ADI（亚德诺）
制造商:
ADI（亚德诺）
分类:
运算放大器
封装:
LFCSP-8
描述:
3内华达州/ Hz的超低失真，高速运算放大器 3 nV/Hz Ultralow Distortion, High Speed Op Amp
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AD8045ACPZ-R2数据手册
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of 8 Go
若手册格式错乱，请下载阅览PDF原文件
Evaluation Board User Guide
UG-084
One Technology Way • P. O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com
Evaluation Board for Single, High Speed Operational Amplifiers
(8-Lead SOIC with Dedicated Feedback Pin and Exposed Paddle)
PLEASE SEE THE LAST PAGE FOR AN IMPORTANT
WARNING AND LEGAL TERMS AND CONDITIONS.
Rev. B | Page 1 of 8
FEATURES
Enables quick breadboarding/prototyping
User-defined circuit configuration
Edge-mounted SMA connector provisions
Easy connection to test equipment and other circuits
GENERAL DESCRIPTION
The 8-lead standard small outline package (SOIC), with a
dedicated feedback pin and an exposed paddle, evaluation
board is designed to aid in the evaluation of single, high speed
operational amplifiers. The evaluation board is a bare board
(that is, there are no components soldered to the board) that
enables users to quickly prototype a variety of operational
amplifier circuits, which minimizes risk and reduces time to
market. The evaluation board supports any of the Analog Devices,
Inc., single, high speed operational amplifiers in an 8-lead SOIC
package with a dedicated feedback pin and an exposed paddle.
Figure 1 shows the component side of the evaluation board, and
Figure 2 shows the circuit side of the evaluation board. Figure 3
shows the evaluation board schematic.
The 4-layer evaluation board accepts edge-mounted Subminiature
Version A (SMA) connectors on both inputs and outputs, which
allows efficient and quick connection to test equipment or other
circuitry.
The board ground plane, component placement, and power
supply bypassing are optimized for maximum circuit flexibility
and performance. The evaluation board uses a variety of surface-
mount technology (SMT) component case sizes: 0402, 0508,
0603, and 7343.
Figure 4 and Figure 6 show the evaluation board assembly
drawings. The metal layout pattern for connecting the board to
the op amp and to the supporting circuitry is shown in Figure 5
and Figure 7.
EVALUATION BOARD COMPONENT SIDE AND CIRCUIT SIDE DIAGRAMS
08787-001
Figure 1. Component Side of the Evaluation Board
08787-002
Figure 2. Circuit Side of the Evaluation Board
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