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CSD23280F3 产品设计参考手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
MOS管
封装:
PICOSTAR-3
描述:
CSD23280F3 12V P 沟道 FemtoFET™ MOSFET
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
焊盘布局在P2
焊接温度在P1P8
应用领域在P11
导航目录
CSD23280F3数据手册
Page:
of 11 Go
若手册格式错乱，请下载阅览PDF原文件
SLRA003D Aug 2014, revised July 2016 Page 2
SMD (Solder Mask Defined) pads are preferred over NSMD (Non Solder Mask Defined) pads to avoid issues due to
solder mask registration error when surface mounting FemtoFET
TM
.
If NSMD configuration has to be used, the following precautions are recommended:
1. A copper layer thickness of less than 1 oz is recommended to achieve higher solder joint stand-off. A 1 oz.
(30 micron) or greater copper thickness causes a lower effective solder joint stand-off, which may
compromise solder joint reliability.
2. The trace width at the connection to the land pad should not exceed 2/3 of the pad diameter.
3. Control the solder mask shift on the PCB to avoid inconsistent pad size.
A C
B
B D
Non-Solder Mask Defined Pad (NSMD)
Not-Preferred
Solder Mask Defined Pad (SMD)
Preferred
Copper Pad
Solder Mask
Opening
Copper Pad
Solder Mask
Opening
“A”
“B”
“C”
“D”
PCB Design Guidelines
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