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DRV8302-HC-C2-KIT 产品设计参考手册 - TI(德州仪器)
制造商:
TI(德州仪器)
分类:
开发套件
描述:
TEXAS INSTRUMENTS DRV8302-HC-C2-KIT 评估板, DRV8302 无刷直流电机驱动器
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P10P59Hot
典型应用电路图在P37P65
原理图在P3P57P64P67P70P73P75P88P90P93
封装尺寸在P153P154P155
标记信息在P153P154P155P156
封装信息在P153P154P155P156
技术参数、封装参数在P33P34P50P105P106P107P108P109P110P111P112P113
应用领域在P2P53P126P157
电气规格在P15P34P50P105P106P107P108P109P110P111P112P113
导航目录
DRV8302-HC-C2-KIT数据手册
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若手册格式错乱,请下载阅览PDF原文件

TMS320F28030, TMS320F28031, TMS320F28032
TMS320F28033, TMS320F28034, TMS320F28035
SPRS584J –APRIL 2009–REVISED OCTOBER 2013
www.ti.com
LOCATION ADDITIONS, DELETIONS, AND MODIFICATIONS
Section 4.5 Local Interconnect Network (LIN):
• Added reference to TMS320F2803x Piccolo Local Interconnect Network (LIN) Module User's Guide
(literature number SPRUGE2)
Section 4.6 Enhanced Controller Area Network (eCAN) Module:
• Added reference to TMS320x2803x Piccolo Enhanced Controller Area Network (eCAN) Reference
Guide (literature number SPRUGL7)
Section 4.7 Inter-Integrated Circuit (I
2
C):
• Added reference to TMS320x2802x, 2803x Piccolo Inter-Integrated Circuit (I2C) Module Reference
Guide (literature number SPRUFZ9)
Section 4.9 High-Resolution PWM (HRPWM):
• Added reference to TMS320x2802x, 2803x Piccolo High Resolution Pulse Width Modulator (HRPWM)
Reference Guide (literature number SPRUGE8)
Section 4.10 Enhanced Capture Module (eCAP1):
• Added reference to TMS320F2802x, 2803x Piccolo Enhanced Capture (eCAP) Module Reference
Guide (literature number SPRUFZ8)
Section 4.11 High-Resolution Capture (HRCAP) Module:
• Revised "The HRCAP module includes one capture channel in addition to a high-resolution calibration
block ..." paragraph
• Added reference to TMS320x2803x Piccolo High Resolution Capture (HRCAP) Reference Guide
(literature number SPRUH56)
Section 4.12 Enhanced Quadrature Encoder Pulse (eQEP):
• Added reference to TMS320x2803x Piccolo Enhanced Quadrature Encoder Pulse (eQEP) Module
Reference Guide (literature number SPRUFK8)
Section 6.9 Power Sequencing:
• Removed "Furthermore, V
DDIO
and V
DDA
should always be within 0.3 V of each other" sentence from
"There is no power sequencing requirement needed ..." paragraph
Table 6-22 High-Resolution PWM Characteristics:
• Updated footnote about maximum MEP step size: Changed "Maximum MEP step size is based on
worst-case process, maximum temperature and maximum voltage" to "Maximum MEP step size is
based on worst-case process, maximum temperature and minimum voltage"
Table 6-44 Flash Parameters at 60-MHz SYSCLKOUT:
• Updated "Typical parameters as seen at room temperature ..." footnote
6 Contents Copyright © 2009–2013, Texas Instruments Incorporated
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