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LPC1343FBD48,151 产品设计参考手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
微控制器
封装:
LQFP-48
描述:
ARM Cortex-M3 Microcontrollers, NXP基于 NXP ARM Cortex-M3 的微控制器，适用于嵌入式应用，具有高集成水平并提供系统增强功能，例如低功耗、增强调试功能和更高级别的块集成支持。Cortex-M3 核可最高以 150 MHz 运行 高达 512KB 的闪存和高达 64KB 的片上 SRAM 低功耗，用于 LPC13xx 设备时低至 200μA/MHz 新唤醒中断控制器 (WIC)、套放向量中断控制器 (NVIC) 和存储器保护装置 配有先进的外围设备，如以太网、USB 主机/OTG/设备、CAN、IS、快速模式 Plus (Fm+) IC、12 位 ADC、电机控制 PWM、正交编码器接口和其他。 ### ARM Cortex 微控制器，NXP
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引脚图在P13P120P121P122P123P124P125P126P127P128P129P130Hot
原理图在P8P305
型号编码规则在P6
功能描述在P55P88P137P140P142P152P164P165P200P209P252P260
应用领域在P209P229P232P235P236P239P241P268P282P301P307P353
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LPC1343FBD48,151数据手册
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UM10375 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
User manual Rev. 5 — 21 June 2012 6 of 370
NXP Semiconductors
UM10375
Chapter 1: LPC13xx Introductory information
• System PLL allows CPU operation up to the maximum CPU rate without the need for
a high-frequency crystal. May be run from the system oscillator or the internal RC
oscillator.
• For USB (LPC1342/43), a second, dedicated PLL is provided.
• Code Read Protection (CRP) with different security levels.
• Unique device serial number for identification.
• Available as 48-pin LQFP package and 33-pin HVQFN package.
1.4 Ordering options
Table 1. Ordering information
Type number Package
Name Description Version
LPC1311FHN33 HVQFN33 HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1311FHN33/01 HVQFN33 HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1313FHN33 HVQFN33 HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1313FHN33/01 HVQFN33 HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1313FBD48 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7
1.4 mm
SOT313-2
LPC1313FBD48/01 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7
1.4 mm
SOT313-2
LPC1342FHN33 HVQFN33 HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1342FBD48 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7
1.4 mm
SOT313-2
LPC1343FHN33 HVQFN33 HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1343FBD48 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7
1.4 mm
SOT313-2
Table 2. Ordering options for LPC13xx
Type number Flash Total
SRAM
USB Power
profiles
UART
RS-485
I
2
C/
Fast+
SSP ADC
channels
Pins Package
LPC1311FHN33 8 kB 4 kB - no 1 1 1 8 33 HVQFN33
LPC1311FHN33/01 8 kB 4 kB - yes 1 1 1 8 33 HVQFN33
LPC1313FHN33 32 kB 8 kB - no 1 1 1 8 33 HVQFN33
LPC1313FHN33/01 32 kB 8 kB - yes 1 1 1 8 33 HVQFN33
LPC1313FBD48 32 kB 8 kB - no 1 1 1 8 48 LQFP48
LPC1313FBD48/01 32 kB 8 kB - yes 1 1 2 8 48 LQFP48
LPC1342FHN33 16 kB 4 kB Device no 1 1 1 8 33 HVQFN33
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