Datasheet 搜索 > 8位微控制器 > Microchip（微芯） > PIC16F1716-I/SP 数据手册 > PIC16F1716-I/SP 产品设计参考手册 5/101 页
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PIC16F1716-I/SP 产品设计参考手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
8位微控制器
封装:
DIP-28
描述:
MICROCHIP PIC16F1716-I/SP 微控制器, 8位, 闪存, AEC-Q100, PIC16F17xx, 32 MHz, 14 KB, 1 KB, 28 引脚, SPDIP
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引脚图在P14Hot
原理图在P17P18P19P97P99
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PIC16F1716-I/SP数据手册
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若手册格式错乱，请下载阅览PDF原文件
2012 Microchip Technology Inc. DS41628B-page 5
3.7 Lesson 6: Debounce ............................................................................... 62
3.7.1 Introduction ............................................................................................ 62
3.7.2 Hardware Effects ................................................................................... 62
3.7.3 Summary ............................................................................................... 63
3.7.4 New Registers ....................................................................................... 63
3.7.5 New Instructions .................................................................................... 63
3.7.6 Assembly ............................................................................................... 63
3.7.7 PIC18 ..................................................................................................... 63
3.7.8 C Language ........................................................................................... 63
3.8 Lesson 7: Reversible Variable Speed Rotate ......................................... 64
3.8.1 Introduction ............................................................................................ 64
3.8.2 Hardware Effects ................................................................................... 64
3.8.3 Summary ............................................................................................... 64
3.8.4 New Registers ....................................................................................... 65
3.8.5 New Instructions .................................................................................... 65
3.8.6 Assembly ............................................................................................... 65
3.8.7 C Language ........................................................................................... 66
3.9 Lesson 8: Pulse-Width Modulation (PWM) ............................................. 67
3.9.1 Introduction ............................................................................................ 67
3.9.2 Hardware Effects ................................................................................... 67
3.9.3 Summary ............................................................................................... 67
3.9.4 New Registers ....................................................................................... 67
3.9.5 Assembly ............................................................................................... 70
3.10 Lesson 9: Timer0 .................................................................................... 71
3.10.1 Introduction ............................................................................................ 71
3.10.2 Hardware Effects ................................................................................... 71
3.10.3 Summary ............................................................................................... 71
3.10.4 New Registers ....................................................................................... 71
3.10.5 Assembly ............................................................................................... 72
3.10.6 C Language ........................................................................................... 72
3.11 Lesson 10: Interrupts and Pull-ups ......................................................... 73
3.11.1 Introduction ............................................................................................ 73
3.11.2 Hardware Effects ................................................................................... 73
3.11.3 Summary ............................................................................................... 73
3.11.4 New Registers ....................................................................................... 75
3.11.5 New Instructions .................................................................................... 76
3.11.6 Assembly ............................................................................................... 76
3.11.7 C Language ........................................................................................... 77
3.12 Lesson 11: Indirect Addressing .............................................................. 78
3.12.1 Introduction ............................................................................................ 78
3.12.2 Hardware Effects ................................................................................... 78
3.12.3 Summary ............................................................................................... 78
3.12.4 New Registers ....................................................................................... 80
3.12.5 New Instructions .................................................................................... 80
3.12.6 Assembly Language .............................................................................. 81
3.12.7 C language ............................................................................................ 82
3.13 Lesson 12: Look-up Table ..................................................................... 83
3.13.1 Intro ....................................................................................................... 83
3.13.2 Hardware Effects ................................................................................... 83
3.13.3 Summary ............................................................................................... 83
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