Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC18F27J53-I/SP 数据手册 > PIC18F27J53-I/SP 产品设计参考手册 3/32 页
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PIC18F27J53-I/SP 产品设计参考手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DIP-28
描述:
MICROCHIP PIC18F27J53-I/SP 微控制器, 8位, 闪存, AEC-Q100, PIC18FxxJxx, 48 MHz, 128 KB, 3.7109 KB, 28 引脚, DIP
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原理图在P7P14P15P16P27P29
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PIC18F27J53-I/SP数据手册
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若手册格式错乱，请下载阅览PDF原文件
PIC18F4XJ5X FULL-SPEED USB
DEMONSTRATION BOARD
USER’S GUIDE
2010 Microchip Technology Inc. DS51806B-page 3
Table of Contents
Preface ........................................................................................................................... 5
Chapter 1. Introduction
1.1 Introduction ................................................................................................ 11
1.2 Demonstration Board Package Contents................................................... 11
1.3 PIC18F4XJ5X Families’ USB Capabilities ................................................. 11
Chapter 2. Board Hardware
2.1 Power Management................................................................................... 14
2.2 LEDs .......................................................................................................... 15
2.3 Push Buttons.............................................................................................. 15
2.4 Jumpers ..................................................................................................... 15
2.5 Programming the Microcontroller............................................................... 16
2.6 Operation with the PIC18 Explorer or PICDEM™ HPC Explorer Boards .. 17
Chapter 3. Preprogrammed Firmware
3.1 Overview .................................................................................................... 19
3.2 Using the Composite HID+MSD Class Demo Firmware............................ 21
3.3 Using the HID Bootloader Firmware .......................................................... 22
Appendix A. Troubleshooting Tips ............................................................................ 25
Appendix B. Board Schematics.................................................................................. 27
Appendix C. Revision History..................................................................................... 31
Worldwide Sales and Service .................................................................................... 32
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