Datasheet 搜索 > 温度传感器 > TI（德州仪器） > TMP103BYFFT 数据手册 > TMP103BYFFT 产品设计参考手册 1/21 页
器件3D模型￥ 7.034
TMP103BYFFT 产品设计参考手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
温度传感器
封装:
DSBGA-4
描述:
2 线数字温度传感器Texas Instrument 的 2 线数字温度传感器系列均随附片上 ADC。 多数可以测量多个设备的温度，并具有 SMBus 和 I²C 兼容接口。 该传感器适合各种应用，例如移动电话、笔记本电脑、热系统管理和环境监测以及 HVAC。 **特点；** 2 线操作 关闭模式 可编程温度分辨率在 9 至 14 位之间变化（取决于设备） ### 温度和湿度传感器，Texas Instruments
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
原理图在P4P5P17
应用领域在P3P21
导航目录
TMP103BYFFT数据手册
Page:
of 21 Go
若手册格式错乱，请下载阅览PDF原文件
User's Guide
SBOU099–January 2011
TMP103EVM
This user's guide describes the characteristics, operation, and use of the TMP103EVM evaluation board. It
provides a detailed description of the hardware design. It discusses how to set up and configure the
evaluation module (EVM) software, and reviews the hardware and various aspects of the software
operation. This document also includes information regarding operating procedures and input/output
connections, an electrical schematic, printed circuit board (PCB) layout drawings, and a parts list for the
TMP103EVM. Throughout this document, the terms evaluation board, evaluation module, and EVM are
synonymous with the TMP103EVM.
Contents
1 Overview ..................................................................................................................... 2
2 System Setup ................................................................................................................ 3
3 Theory of Operation ........................................................................................................ 4
4 TMP103EVM Hardware Overview ........................................................................................ 5
5 TMP103EVM Software Setup ............................................................................................. 8
6 TMP103EVM Software Overview ....................................................................................... 11
7 TMP103EVM Documentation ............................................................................................ 17
8 Bill of Materials ............................................................................................................. 19
List of Figures
1 Typical Hardware Included with the TMP103EVM Kit ................................................................. 2
2 TMP103EVM Hardware Setup............................................................................................ 3
3 TMP103 Test Board Block Diagram...................................................................................... 4
4 SM-USB-DIG Platform Block Diagram................................................................................... 5
5 Connecting the USB Cable to the SM-USB-DIG Platform............................................................. 6
6 SM-USB-DIG Platform Driver Installation Confirmation................................................................ 6
7 10-Pin Ribbon Cable Extender............................................................................................ 8
8 TMP10EVM Software Install Window .................................................................................... 9
9 TMP103EVM License Agreements ..................................................................................... 10
10 TMP103EVM Software About Button................................................................................... 10
11 TMP103EVM Software Interface: Proper Operation.................................................................. 11
12 Communication Error with USB DIG Platform......................................................................... 11
13 TMP103EVM Software: Reading from Registers ..................................................................... 12
14 TMP103EVM Software: Writing to Registers .......................................................................... 13
15 Conversion Time Selection Dialog ...................................................................................... 14
16 Max Temp Flag Trigger................................................................................................... 14
17 TMP103EVM Software: Register Tab .................................................................................. 15
18 TMP103EVM Software: Test Procedure ............................................................................... 16
19 TMP103EVM Schematic.................................................................................................. 17
20 TMP103EVM Component Layout ....................................................................................... 18
Microsoft, Windows are registered trademarks of Microsoft Corporation.
I
2
C is a trademark of NXP Semiconductors.
WinZIP is a registered trademark of WinZip International LLC.
All other trademarks are the property of their respective owners.
1
SBOU099–January 2011 TMP103EVM
Submit Documentation Feedback
© 2011, Texas Instruments Incorporated
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
