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TMS320C28343 产品设计参考手册 - TI（德州仪器）
制造商:
TI（德州仪器）
封装:
BGA-256
描述:
Delfino 微处理器
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P15Hot
典型应用电路图在P45P88
原理图在P34P54P62P70P72P79P87P90P93P99
封装尺寸在P166
标记信息在P166P167
封装信息在P166P167
技术参数、封装参数在P43P107P108P109P110P111P112P113P114P115P116P117
应用领域在P58P105P129P170
电气规格在P43P107P108P109P110P111P112P113P114P115P116P117
导航目录
TMS320C28343数据手册
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TMS320C28346, TMS320C28345, TMS320C28344
TMS320C28343, TMS320C28342, TMS320C28341
www.ti.com
SPRS516D –MARCH 2009–REVISED AUGUST 2012
4.10 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C) .......................................... 84
4.11 Serial Peripheral Interface (SPI) Module (SPI-A, SPI-D) ............................................................. 88
4.12 Inter-Integrated Circuit (I2C) ............................................................................................. 91
4.13 GPIO MUX ................................................................................................................. 92
4.14 External Interface (XINTF) ............................................................................................... 99
5 Device Support ................................................................................................................ 101
5.1 Device and Development Support Tool Nomenclature ............................................................. 101
5.2 Documentation Support ................................................................................................. 103
5.3 Community Resources .................................................................................................. 106
6 Electrical Specifications ................................................................................................... 107
6.1 Absolute Maximum Ratings ............................................................................................ 107
6.2 Recommended Operating Conditions ................................................................................. 108
6.3 Electrical Characteristics ................................................................................................ 108
6.4 Current Consumption .................................................................................................... 109
6.4.1 Reducing Current Consumption ............................................................................. 111
6.5 Thermal Design Considerations ....................................................................................... 113
6.6 Emulator Connection Without Signal Buffering for the MCU ....................................................... 113
6.7 Timing Parameter Symbology .......................................................................................... 114
6.7.1 General Notes on Timing Parameters ...................................................................... 114
6.7.2 Test Load Circuit .............................................................................................. 114
6.7.3 Device Clock Table ........................................................................................... 115
6.8 Clock Requirements and Characteristics ............................................................................. 117
6.9 Power Sequencing ....................................................................................................... 118
6.9.1 Power Management and Supervisory Circuit Solutions .................................................. 119
6.10 General-Purpose Input/Output (GPIO) ................................................................................ 122
6.10.1 GPIO - Output Timing ........................................................................................ 122
6.10.2 GPIO - Input Timing .......................................................................................... 123
6.10.3 Sampling Window Width for Input Signals ................................................................. 124
6.10.4 Low-Power Mode Wakeup Timing .......................................................................... 125
6.11 Enhanced Control Peripherals ......................................................................................... 128
6.11.1 Enhanced Pulse Width Modulator (ePWM) Timing ....................................................... 128
6.11.2 Trip-Zone Input Timing ....................................................................................... 128
6.11.3 High-Resolution PWM Timing ............................................................................... 129
6.11.4 Enhanced Capture (eCAP) Timing ......................................................................... 129
6.11.5 Enhanced Quadrature Encoder Pulse (eQEP) Timing ................................................... 130
6.11.6 ADC Start-of-Conversion Timing ............................................................................ 131
6.12 External Interrupt Timing ................................................................................................ 131
6.13 I2C Electrical Specification and Timing ............................................................................... 132
6.14 Serial Peripheral Interface (SPI) Timing .............................................................................. 132
6.14.1 Master Mode Timing .......................................................................................... 132
6.14.2 SPI Slave Mode Timing ...................................................................................... 137
6.15 External Interface (XINTF) Timing ..................................................................................... 140
6.15.1 USEREADY = 0 ............................................................................................... 140
6.15.2 Synchronous Mode (USEREADY = 1, READYMODE = 0) ............................................. 141
6.15.3 Asynchronous Mode (USEREADY = 1, READYMODE = 1) ............................................ 142
6.15.4 XINTF Signal Alignment to XCLKOUT ..................................................................... 144
6.15.5 External Interface Read Timing ............................................................................. 145
6.15.6 External Interface Write Timing ............................................................................. 147
6.15.7 External Interface Ready-on-Read Timing With One External Wait State ............................ 149
6.15.8 External Interface Ready-on-Write Timing With One External Wait State ............................. 152
6.15.9 XHOLD and XHOLDA Timing ............................................................................... 155
6.16 Multichannel Buffered Serial Port (McBSP) Timing ................................................................. 157
6.16.1 McBSP Transmit and Receive Timing ...................................................................... 157
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