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器件3D模型￥ 69.213
TMS320C5515AZCH10 产品设计参考手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
LFBGA-196
描述:
TEXAS INSTRUMENTS TMS320C5515AZCH10 芯片, 数字信号处理器, 16位, 100MHZ, NFBGA-196
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P15P63P66Hot
典型应用电路图在P139
原理图在P4
封装尺寸在P158
标记信息在P158
封装信息在P157P158P159
功能描述在P62
技术参数、封装参数在P12P72P77P78P79P80P81P82P83P84P85P86
应用领域在P1P161
电气规格在P12P38P42P70P74P75P76P77P78P79P80P81
导航目录
TMS320C5515AZCH10数据手册
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若手册格式错乱，请下载阅览PDF原文件
TMS320C5515
www.ti.com
SPRS645E –AUGUST 2010– REVISED JANUARY 2012
TMS320C5515 Fixed-Point Digital Signal Processor
Check for Samples: TMS320C5515
1 Fixed-Point Digital Signal Processor
1.1 Features
12
• High-Performance, Low-Power, TMS320C55x™ • Device USB Port With Integrated 2.0
Fixed-Point Digital Signal Processor High-Speed PHY that Supports:
– 16.67-, 13.33-, 10-, 8.33-ns Instruction Cycle – USB 2.0 Full- and High-Speed Device
Time
• LCD Bridge With Asynchronous Interface
– 60-, 75-, 100-, 120-MHz Clock Rate
• Tightly-Coupled FFT Hardware Accelerator
– One/Two Instruction(s) Executed per Cycle
• 10-Bit 4-Input Successive Approximation (SAR)
– Dual Multipliers [Up to 200 or 240 Million ADC
Multiply-Accumulates per Second (MMACS)]
• Real-Time Clock (RTC) With Crystal Input, With
– Two Arithmetic/Logic Units (ALUs) Separate Clock Domain and Power Supply
– Three Internal Data/Operand Read Buses • Four Core Isolated Power Supply Domains:
and Two Internal Data/Operand Write Buses Analog, RTC, CPU and Peripherals, and USB
– Software-Compatible With C55x Devices • Four I/O Isolated Power Supply Domains: RTC
I/O, EMIF I/O, USB PHY, and DV
DDIO
– Industrial Temperature Devices Available
• Three integrated LDOs (DSP_LDO, ANA_LDO,
• 320K Bytes Zero-Wait State On-Chip RAM,
and USB_LDO) to power the isolated domains:
Composed of:
DSP Core, Analog, and USB Core, respectively
– 64K Bytes of Dual-Access RAM (DARAM),
• Low-Power S/W Programmable Phase-Locked
8 Blocks of 4K x 16-Bit
Loop (PLL) Clock Generator
– 256K Bytes of Single-Access RAM (SARAM),
• On-Chip ROM Bootloader (RBL) to Boot From
32 Blocks of 4K x 16-Bit
NAND Flash, NOR Flash, SPI EEPROM, SPI
• 128K Bytes of Zero Wait-State On-Chip ROM
Serial Flash or I2C EEPROM
(4 Blocks of 16K x 16-Bit)
• IEEE-1149.1 (JTAG™)
• 4M x 16-Bit Maximum Addressable External
Boundary-Scan-Compatible
Memory Space (SDRAM/mSDRAM)
• Up to 26 General-Purpose I/O (GPIO) Pins
• 16-/8-Bit External Memory Interface (EMIF) with
(Multiplexed With Other Device Functions)
Glueless Interface to:
• 196-Terminal Pb-Free Plastic BGA (Ball Grid
– 8-/16-Bit NAND Flash, 1- and 4-Bit ECC
Array) (ZCH Suffix)
– 8-/16-Bit NOR Flash
• 1.05-V Core (60 or 75 MHz), 1.8-V, 2.5-V, 2.75-V,
– Asynchronous Static RAM (SRAM)
or 3.3-V I/Os
– SDRAM/mSDRAM (1.8-, 2.5-, 2.75-, and 3.3-V)
• 1.3-V Core (100, 120 MHz), 1.8-V, 2.5-V, 2.75-V,
• Direct Memory Access (DMA) Controller
or 3.3-V I/Os
– Four DMA With 4 Channels Each
• Applications:
(16-Channels Total)
– Wireless Audio Devices (e.g., Headsets,
• Three 32-Bit General-Purpose Timers
Microphones, Speakerphones, etc.)
– One Selectable as a Watchdog and/or GP
– Echo Cancellation Headphones
• Two MultiMedia Card/Secure Digital (MMC/SD)
– Portable Medical Devices
Interfaces
– Voice Applications
• Universal Asynchronous Receiver/Transmitter
– Industrial Controls
(UART)
– Fingerprint Biometrics
• Serial-Port Interface (SPI) With Four
– Software Defined Radio
Chip-Selects
• Master/Slave Inter-Integrated Circuit (I
2
C Bus™)
• Four Inter-IC Sound (I
2
S Bus™) for Data
Transport
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to
Copyright © 2010–2012, Texas Instruments Incorporated
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
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