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5
TMS320F28027
,
TMS320F28026
,
TMS320F28023
,
TMS320F28022
TMS320F28021
,
TMS320F28020
,
TMS320F280200
www.ti.com
SPRS523K NOVEMBER 2008REVISED JUNE 2016
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Product Folder Links: TMS320F28027 TMS320F28026 TMS320F28023 TMS320F28022 TMS320F28021
TMS320F28020 TMS320F280200
Revision HistoryCopyright © 2008–2016, Texas Instruments Incorporated
2 Revision History
Changes from October 8, 2013 to June 27, 2016 (from J Revision (October 2013) to K Revision) Page
Global: Restructured document. .................................................................................................. 1
Global: Added ESD Ratings table; Detailed Description section; Device and Documentation Support section;
and Mechanical Packaging and Orderable Information section. ............................................................... 1
Global: Added InstaSPIN-FOC™ devices TMS320F28027F and TMS320F28026F. See Table 3-1. ................... 1
Global: Removed "Analog MUX" table (this was Table 4-12 in SPRS523J). ............................................... 1
Global: Removed references to the Reliability Data for TMS320LF24xx and TMS320F28xx Devices Application
Report. ................................................................................................................................. 1
Section 1.1 (Features): Removed "Dynamic PLL Ratio Changes Supported" feature. ..................................... 1
Device Information: Added table. .................................................................................................. 2
Table 3-1 (Device Comparison): Changed title from "Hardware Features" to "Device Comparison". .................... 6
Table 3-1: Added InstaSPIN-FOC devices TMS320F28027F and TMS320F28026F. ..................................... 6
Table 3-1: Added footnote with reference to a list of InstaSPIN™ Technical Reference Manuals. ....................... 6
Table 3-1: Removed "Product status" row and associated footnote. ......................................................... 6
Section 3.1 (Related Products): Added section. ................................................................................. 8
Section 4.2 (Signal Descriptions): Updated NOTE. ............................................................................ 11
Table 4-1 (Signal Descriptions): Changed title from "Terminal Functions" to "Signal Descriptions". .................... 11
Table 4-1: Updated DESCRIPTION of X1, XRS, V
REFHI
, V
REFLO
, V
DD
, and V
DDIO
. ......................................... 11
Section 5.1 (Absolute Maximum Ratings): Added Input voltage, V
IN
(X1). ................................................. 16
Section 5.3 (Recommended Operating Conditions): Removed "V
DDIO
and V
DDA
should be maintained within ~0.3
V of each other" footnote. ......................................................................................................... 17
Section 5.4 (Power Consumption Summary): Changed section title from "Current Consumption" to "Power
Consumption Summary". .......................................................................................................... 18
Section 5.11 (Power Sequencing): Updated "There is no power sequencing requirement needed ..." paragraph. ... 27
Table 5-11 (Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics): Updated footnote about oscillator
accuracy. ............................................................................................................................ 32
Table 6-11 (Device Emulation Registers): Added PARTID for TMS320F28027F and TMS320F28026F devices. .... 54
Table 6-11: Added CLASSID for TMS320F28027F and TMS320F28026F devices. ...................................... 54
Table 6-11: Added REVID for silicon revision B. ............................................................................... 54
Figure 6-6 (VREG + POR + BOR + Reset Signal Connectivity): Updated figure. ......................................... 56
Section 6.6.2 (Crystal Oscillator Option): Added "The on-chip crystal oscillator X1 and X2 pins are 1.8-V level
signals ..." paragraph. .............................................................................................................. 60
Figure 6-12 (CPU-watchdog Module): Updated figure. ........................................................................ 64
Table 6-33 (SPI Master Mode External Timing (Clock Phase = 0)): Parameter 9 [t
v(SPCL-SOMI)M
, t
v(SPCH-SOMI)M
]:
Changed MIN values to 0. ......................................................................................................... 90
Table 6-34 (SPI Master Mode External Timing (Clock Phase = 1)): Parameter 11 [t
v(SPCH-SOMI)M
, t
v(SPCL-SOMI)M
]:
Changed MIN values to 0. ......................................................................................................... 92
Table 6-35 (SPI Slave Mode External Timing (Clock Phase = 0)): Parameter 16 [t
v(SPCL-SOMI)S
, t
v(SPCH-SOMI)S
]:
Changed MIN values to 0. ......................................................................................................... 94
Table 6-36 (SPI Slave Mode External Timing (Clock Phase = 1)): Parameter 18 [t
v(SPCL-SOMI)S
, t
v(SPCH-SOMI)S
]:
Changed MIN values to 0. ......................................................................................................... 95
Section 6.9.10 (Pin Multiplexing): Changed title from "GPIO MUX" to "General-Purpose Input/Output (GPIO)
MUX". ............................................................................................................................... 111
Table 6-51 (Analog MUX for 48-Pin PT Package): Added table. ........................................................... 113
Table 6-52 (Analog MUX for 38-Pin DA Package): Added table. .......................................................... 114
Section 7 (Applications, Implementation, and Layout): Added section. .................................................... 123
Section 8 (Device and Documentation Support): Added section. .......................................................... 124
Section 8.1 (Getting Started): Updated links. ................................................................................. 124
Figure 8-1 (Device Nomenclature): Updated list of devices. ................................................................ 125
Section 8.3 (Tools and Software): Added section. ........................................................................... 125
Section 8.4 (Documentation Support): Updated section. .................................................................... 127

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