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ATTINY861V-10MU 用户编程技术手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
VQFN-32
描述:
单片机(MCU/MPU/SOC) ATTINY861V-10MU MLF-32(5x5)
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ATTINY861V-10MU数据手册
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2
2588FS–AVR–06/2013
ATtiny261/461/861
1. Pin Configurations
Figure 1-1. Pinout ATtiny261/461/861 and ATtiny261V/461V/861V
Note: To ensure mechanical stability the center pad underneath the QFN/MLF package should be soldered to ground on the board.
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
(MOSI/DI/SDA/OC1A/PCINT8) PB0
(MISO/DO/OC1A/PCINT9) PB1
(SCK/USCK/SCL/OC1B/PCINT10) PB2
(OC1B/PCINT11) PB3
VCC
GND
(ADC7/OC1D/CLKI/XTAL1/PCINT12) PB4
(ADC8/OC1D/CLKO/XTAL2/PCINT13) PB5
(ADC9/INT0/T0/PCINT14) PB6
(ADC10/RESET/PCINT15) PB7
PA0 (ADC0/DI/SDA/PCINT0)
PA1 (ADC1/DO/PCINT1)
PA2 (ADC2/INT1/USCK/SCL/PCINT2)
PA3 (AREF/PCINT3)
AGND
AVCC
PA4 (ADC3/ICP0/PCINT4)
PA5 (ADC4/AIN2/PCINT5)
PA6 (ADC5/AIN0/PCINT6)
PA7 (ADC6/AIN1/PCINT7)
PDIP/SOIC
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
32
31
30
29
28
27
26
25
9
10
11
12
13
14
15
16
NC
(OC1B/PCINT11) PB3
NC
VCC
GND
NC
(ADC7/OC1D/CLKI/XTAL1/PCINT12) PB4
(ADC8/OC1D/CLKO/XTAL2/PCINT13) PB5
NC
PA2 (ADC2/INT1/USCK/SCL/PCINT2)
PA3 (AREF/PCINT3)
AGND
NC
NC
AVCC
PA4 (ADC3/ICP0/PCINT4)
NC
(ADC9/INT0/T0/PCINT14) PB6
(ADC10/RESET/PCINT15) PB7
NC
(ADC6/AIN1/PCINT7) PA7
(ADC5/AIN0/PCINT6) PA6
(ADC4/AIN2/PCINT5) PA5
NC
PB2 (SCK/USCK/SCL/OC1B/PCINT10)
PB1 (MISO/DO/OC1A/PCINT9)
PB0 (MOSI/DI/SDA/OC1A/PCINT8)
NC
NC
NC
PA0 (ADC0/DI/SDA/PCINT0)
PA1 (ADC1/DO/PCINT1)
QFN/MLF
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