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DSPIC33EP512MU810T-I/PT 用户编程技术手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
TQFP-100
描述:
数字信号处理器和控制器 - DSP, DSC 100P 512KB Flsh 52KB RAM 60MHz USB
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DSPIC33EP512MU810T-I/PT数据手册
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若手册格式错乱，请下载阅览PDF原文件
© 2009-2011 Microchip Technology Inc. DS70619B-page 1
dsPIC33E/PIC24E
1.0 DEVICE OVERVIEW
This document defines the programming specification
for the dsPIC33E 16-bit Digital Signal Controller (DSC)
and PIC24E 16-bit Microcontroller (MCU) families. This
programming specification is required only for those
developing programming support for the dsPIC33E/
PIC24E family. All other customers should use
development tools that already provide support for
device programming.
Topics covered include:
• Section 1.0 “Device Overview”
• Section 2.0 “Programming Overview of the
dspic33e/PIC24E”
• Section 3.0 “Device Programming – Enhanced
ICSP”
• Section 4.0 “Checksum Computation”
• Section 5.0 “The Programming Executive”
• Section 6.0 “Device Programming – ICSP”
• Section 7.0 “Programming the Programming
Executive to Memory”
• Section 8.0 “Device ID”
• Section 9.0 “AC/DC Characteristics and
Timing Requirements”
• Appendix A: “Hex File Format”
• Appendix B: “Revision History”
2.0 PROGRAMMING OVERVIEW
OF THE dsPIC33E/PIC24E
There are two methods of programming the dsPIC33E/
PIC24E family of devices discussed in this
programming specification. They are:
• In-Circuit Serial Programming™ (ICSP™)
programming capability
• Enhanced In-Circuit Serial Programming
The ICSP programming method is the most direct
method to program the device; however, it is also the
slower of the two methods. It provides native, low-level
programming capability to erase, program and verify
the chip.
The Enhanced ICSP protocol uses a faster method that
takes advantage of the programming executive, as
illustrated in Figure 2-1. The programming executive
provides all the necessary functionality to erase,
program and verify the chip through a small command
set. The command set allows the programmer to
program the dsPIC33E/PIC24E Programming
Specification devices without having to deal with the
low-level programming protocols of the chip.
FIGURE 2-1: PROGRAMMING SYSTEM
OVERVIEW FOR
ENHANCED ICSP™
This specification is divided into major sections that
describe the programming methods independently.
Section 3.0 “Device Programming – Enhanced
ICSP” describes the Enhanced ICSP method.
Section 6.0 “Device Programming – ICSP” describes
the ICSP method.
dsPIC33E/PIC24E
Programmer
Programming
Executive
On-Chip Memory
dsPIC33E/PIC24E Flash Programming Specification
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