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PIC24EP512GU810T-I/PF
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PIC24EP512GU810T-I/PF数据手册
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© 2009-2011 Microchip Technology Inc. DS70619B-page 1
dsPIC33E/PIC24E
1.0 DEVICE OVERVIEW
This document defines the programming specification
for the dsPIC33E 16-bit Digital Signal Controller (DSC)
and PIC24E 16-bit Microcontroller (MCU) families. This
programming specification is required only for those
developing programming support for the dsPIC33E/
PIC24E family. All other customers should use
development tools that already provide support for
device programming.
Topics covered include:
Section 1.0 “Device Overview”
Section 2.0 “Programming Overview of the
dspic33e/PIC24E”
Section 3.0 “Device Programming – Enhanced
ICSP”
Section 4.0 “Checksum Computation”
Section 5.0 “The Programming Executive”
Section 6.0 “Device Programming – ICSP”
Section 7.0 “Programming the Programming
Executive to Memory”
Section 8.0 “Device ID”
Section 9.0 “AC/DC Characteristics and
Timing Requirements”
Appendix A: “Hex File Format”
Appendix B: “Revision History”
2.0 PROGRAMMING OVERVIEW
OF THE dsPIC33E/PIC24E
There are two methods of programming the dsPIC33E/
PIC24E family of devices discussed in this
programming specification. They are:
In-Circuit Serial Programming™ (ICSP™)
programming capability
Enhanced In-Circuit Serial Programming
The ICSP programming method is the most direct
method to program the device; however, it is also the
slower of the two methods. It provides native, low-level
programming capability to erase, program and verify
the chip.
The Enhanced ICSP protocol uses a faster method that
takes advantage of the programming executive, as
illustrated in Figure 2-1. The programming executive
provides all the necessary functionality to erase,
program and verify the chip through a small command
set. The command set allows the programmer to
program the dsPIC33E/PIC24E Programming
Specification devices without having to deal with the
low-level programming protocols of the chip.
FIGURE 2-1: PROGRAMMING SYSTEM
OVERVIEW FOR
ENHANCED ICSP™
This specification is divided into major sections that
describe the programming methods independently.
Section 3.0 “Device Programming – Enhanced
ICSP” describes the Enhanced ICSP method.
Section 6.0 “Device Programming – ICSP” describes
the ICSP method.
dsPIC33E/PIC24E
Programmer
Programming
Executive
On-Chip Memory
dsPIC33E/PIC24E Flash Programming Specification

PIC24EP512GU810T-I/PF 数据手册

Microchip(微芯)
20 页 / 7.79 MByte
Microchip(微芯)
54 页 / 0.69 MByte
Microchip(微芯)
20 页 / 0.2 MByte
Microchip(微芯)
42 页 / 0.69 MByte

PIC24EP512GU810 数据手册

Microchip(微芯)
MICROCHIP  PIC24EP512GU810-I/PT  微控制器, 16位, AEC-Q100, PIC24EP, 140 MHz, 512 KB, 52 KB, 100 引脚, TQFP
Microchip(微芯)
MICROCHIP  PIC24EP512GU810-I/PF.  芯片, 16位微控制器, PIC24, 60MHZ, 100-TQFP
Microchip(微芯)
PIC24EP512GU810-I/BG, 16 bit PIC 微控制器, 60MHz, 536 kB ROM 闪存, 52 kB RAM USB, 121针 TFBGA封装
Microchip(微芯)
PIC 240MHz 闪存:170K@x24bit
Microchip(微芯)
PIC 240MHz 闪存:170K@x24bit
Microchip(微芯)
PIC 240MHz 闪存:170K@x24bit
Microchip(微芯)
PIC 240MHz 闪存:170K@x24bit
Microchip(微芯)
PIC24EP512GU810-E/BG, 16 bit PIC 微控制器, 60MHz, 536 kB ROM 闪存, 52 kB RAM USB, 121针 TFBGA封装
Microchip(微芯)
PIC 240MHz 闪存:170K@x24bit
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