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SM25 用户编程技术手册 - KEMET Corporation（基美）
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AR0134CS: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Features
‡
AR0134CS/D Rev. 8, Pub. 1/16 EN 1 ©Semiconductor Components Industries, LLC 2016,
1/3-Inch 1.2 Mp CMOS Digital Image Sensor with
Global Shutter
AR0134CS Datasheet, Rev. 8
For the latest datasheet revision, please visit www.onsemi.com
Features
• ON Semiconductor's 3rd Generation Global Shutter
Technology
• Superior low-light performance
• HD video (720p60)
• Video/Single Frame mode
• Flexible row-skip modes
• On-chip AE and statistics engine
• Parallel and serial output
• Support for external LED or flash
• Auto black level calibration
•Context switching
Applications
• Scene processing
• Scanning and machine vision
• 720p60 video applications
General Description
ON Semiconductor's AR0134 is a 1/3-inch 1.2 Mp
CMOS digital image sensor with an active-pixel array
of 1280H x 960V. It is designed for low light perfor-
mance and features a global shutter for accurate cap-
ture of moving scenes. It includes sophisticated
camera functions such as auto exposure control, win-
dowing, scaling, row skip mode, and both video and
single frame modes. It is programmable through a sim-
ple two-wire serial interface. The AR0134 produces
extraordinarily clear, sharp digital pictures, and its
ability to capture both continuous video and single
frames makes it the perfect choice for a wide range of
applications, including scanning and industrial
inspection.
Table 1: Key Parameters
Parameter Typical Value
Optical format 1/3-inch (6 mm)
Active pixels 1280H x 960V = 1.2 Mp
Pixel size 3.75 m
Color filter array RGB Bayer or Monochrome
Shutter type Global shutter
Input clock range 6 – 50 MHz
Output pixel clock (maximum
) 74.25 MHz
Output
Serial HiSPi
Parallel 12-bit
Frame rate
Full resolution 54 fps
720p 60 fps
Responsivity
Monochrome 6.1 V/lux-sec
Color 5.3 V/lux-sec
SNR
MAX
38.6 dB
Dynamic range 64 dB
Supply
voltage
I/O 1.8 or 2.8 V
Digital 1.8 V
Analog 2.8 V
HiSPi 0.4 V
Power consumption <400 mW
Operating temperature
–30°C to +70°C (ambient)
–30°C to +80°C (junction)
Package options
9 x 9 mm 64-pin iBGA
10 x 10 mm 48-pin iLCC
Bare die
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