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TMP401 用户编程技术手册 - TI（德州仪器）
制造商:
TI（德州仪器）
封装:
MSOP-8
描述:
采用 VSSOP-8 封装、具有 N 因数和串联电阻校正的远程和本地温度传感器 8-VSSOP -40 to 125
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4Hot
典型应用电路图在P28P29P30
原理图在P11
封装尺寸在P35P37P38
标记信息在P35
封装信息在P34P35P36P37P38
技术参数、封装参数在P5P12
应用领域在P1P30P41
电气规格在P6P30
型号编号列表在P12
导航目录
TMP401数据手册
Page:
of 41 Go
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TMP401
SBOS371B –AUGUST 2006–REVISED OCTOBER 2014
www.ti.com
Table of Contents
7.3 Feature Description................................................. 12
1 Features.................................................................. 1
7.4 Device Functional Modes........................................ 15
2 Applications ........................................................... 1
7.5 Programming........................................................... 17
3 Description............................................................. 1
7.6 Register Maps......................................................... 20
4 Revision History..................................................... 2
8 Application and Implementation ........................ 28
5 Pin Configuration and Functions......................... 4
8.1 Application Information............................................ 28
6 Specifications......................................................... 5
8.2 Typical Application.................................................. 28
6.1 Absolute Maximum Ratings...................................... 5
9 Power-Supply Recommendations...................... 30
6.2 Handling Ratings....................................................... 5
10 Layout................................................................... 31
6.3 Recommended Operating Conditions....................... 5
10.1 Layout Guidelines ................................................. 31
6.4 Thermal Information.................................................. 5
10.2 Layout Examples................................................... 32
6.5 Electrical Characteristics: V+ = 3 V to 5.5 V............. 6
11 Device and Documentation Support................. 34
6.6 Timing Requirements................................................ 7
11.1 Trademarks........................................................... 34
6.7 Typical Characteristics.............................................. 8
11.2 Electrostatic Discharge Caution............................ 34
7 Detailed Description............................................ 10
11.3 Glossary................................................................ 34
7.1 Overview................................................................. 10
12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram....................................... 11
Information........................................................... 34
4 Revision History
Changes from Revision A (October 2007) to Revision B Page
• Changed format to meet latest data sheet standards ............................................................................................................ 1
• Added Handling Rating, Recommended Operating Conditions, and Thermal Information tables and Feature
Description, Device Functional Modes, Application and Implementation, Power Supply
Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable
Information sections................................................................................................................................................................ 1
• Changed V
S
to V+ throughout document .............................................................................................................................. 1
• Changed last Features bullet ................................................................................................................................................. 1
• Changed Applications section ............................................................................................................................................... 1
• Changed first paragraph and first sentence of second paragraph in Description section ..................................................... 1
• Deleted Device Information Table title.................................................................................................................................... 4
• Changed Input and output voltage parameter name and footnote 2 in Absolute Maximum Ratings table............................ 5
• Changed Operating temperature range maximum specification in Absolute Maximum Ratings table .................................. 5
• Changed HBM specifications in Handling Ratings table ....................................................................................................... 5
• ................................................................................................................................................................................................ 5
• Changed test conditions for TE
REMOTE
parameter in Electrical Characteristics table ............................................................ 6
• Changed Temperature Error, TE
LOCAL
and TE
REMOTE
versus supply parameter name.......................................................... 6
• Deleted SMBus Interface, SMBus clock frequency and SCL falling edge to SDA valid time parameters from
Electrical Characteristics table .............................................................................................................................................. 6
• Changed typical and maximum specifications in first two rows of Power Supply, I
Q
parameter in Electrical
Characteristics table............................................................................................................................................................... 6
• Changed test conditions for third row of Power Supply, I
Q
parameter in Electrical Characteristics table.............................. 6
• Added Power Supply, UVLO parameter to Electrical Characteristics table .......................................................................... 6
• Changed Power Supply, POR parameter maximum specification in Electrical Characteristics table ................................... 6
• Changed Timing Requirements table..................................................................................................................................... 7
• Changed title of Standard and Extended Temperature Measurement Range section ....................................................... 12
• Changed second sentence of High-Speed Mode section ................................................................................................... 16
• Changed range for high-speed mode in Serial Interface section ........................................................................................ 17
• Changed POR value and D0 value in Consecutive alert register row of Table 3 ............................................................... 20
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