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XC7Z030-2FFG676I
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XC7Z030-2FFG676I数据手册
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Zynq-7000 AP SoC (Z-7030, Z-7035, Z-7045, and Z-7100): DC and AC Switching Characteristics
DS191 (v1.17) November 24, 2015 www.xilinx.com
Product Specification 2
V
REF
Input reference voltage
–0.5 2.0 V
V
IN
(3)(4)(5)
I/O input voltage for HR I/O banks –0.40 V
CCO
+0.55 V
I/O input voltage for HP I/O banks –0.55 V
CCO
+0.55 V
I/O input voltage (when V
CCO
= 3.3V) for V
REF
and differential I/O standards
except TMDS_33
(6)
–0.40 2.625 V
V
CCBATT
Key memory battery backup supply
–0.5 2.0 V
GTX Transceiver
V
MGTAVCC
Analog supply voltage for the GTX transmitter and receiver circuits –0.5 1.1 V
V
MGTAVTT
Analog supply voltage for the GTX transmitter and receiver termination circuits –0.5 1.32 V
V
MGTVCCAUX
Auxiliary analog Quad PLL (QPLL) voltage supply for the GTX transceivers –0.5 1.935 V
V
MGTREFCLK
GTX transceiver reference clock absolute input voltage –0.5 1.32 V
V
MGTAVTTRCAL
Analog supply voltage for the resistor calibration circuit of the GTX transceiver
column
–0.5 1.32 V
V
IN
Receiver (RXP/RXN) and Transmitter (TXP/TXN) absolute input voltage –0.5 1.26 V
I
DCIN-FLOAT
DC input current for receiver input pins DC coupled RX termination = floating 14 mA
I
DCIN-MGTAVTT
DC input current for receiver input pins DC coupled RX termination = V
MGTAVTT
–12mA
I
DCIN-GND
DC input current for receiver input pins DC coupled RX termination = GND 6.5 mA
I
DCOUT-FLOAT
DC output current for transmitter pins DC coupled RX termination = floating 14 mA
I
DCOUT-MGTAVTT
DC output current for transmitter pins DC coupled RX termination = V
MGTAVTT
–12mA
XADC
V
CCADC
XADC supply relative to GNDADC
–0.5 2.0 V
V
REFP
XADC reference input relative to GNDADC
–0.5 2.0 V
Temperature
T
STG
Storage temperature (ambient)
–65 150 °C
T
SOL
Maximum soldering temperature for Pb/Sn component bodies
(7)
+220 °C
Maximum soldering temperature for Pb-free component bodies
(7)
+260 °C
T
j
Maximum junction temperature
(7)
+125 °C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. Applies to both MIO supply banks V
CCO_MIO0
and V
CCO_MIO1
.
3. The lower absolute voltage specification always applies.
4. For I/O operation, refer to the 7 Series FPGAs SelectIO Resources User Guide (UG471
) or the Zynq-7000 All Programmable SoC Technical
Reference Manual (UG585
).
5. The maximum limit applies to DC signals. For maximum undershoot and overshoot AC specifications, see Tabl e 4 and Table 5 .
6. See Table 1 2 for TMDS_33 specifications.
7. For soldering guidelines and thermal considerations, see the Zynq-7000 All Programmable SoC Packaging and Pinout Specification
(UG865
).
Tabl e 1: Absolute Maximum Ratings
(1)
(Cont’d)
Symbol Description Min Max Units
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XC7Z030-2FFG676I 数据手册

Xilinx(赛灵思)
13 页 / 0.17 MByte
Xilinx(赛灵思)
80 页 / 2.65 MByte
Xilinx(赛灵思)
85 页 / 2.68 MByte
Xilinx(赛灵思)
17 页 / 0.47 MByte
Xilinx(赛灵思)
5 页 / 0.06 MByte

XC7Z0302FFG676 数据手册

Xilinx(赛灵思)
PSoC/MPSoC微处理器, Zynq-7000 XC7Z030系列, ARM Cortex-A9,800 MHz, FCBGA-676
Xilinx(赛灵思)
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,800 MHz, FCBGA-676
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