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器件3D模型￥ 59.281
STM32F091VBT6 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
32位控制器
封装:
LQFP-100
描述:
STMICROELECTRONICS STM32F091VBT6 微控制器, 32位, 线路接入, ARM 皮质-M0, 48 MHz, 128 KB, 32 KB, 100 引脚, LQFP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P28P29P30P31P32P33P34P35P36P37P38P39Hot
典型应用电路图在P70P71P88
原理图在P12
封装尺寸在P100P101P102P103P104P105P106P107P108P109P110P111
型号编码规则在P121P122P123P124
技术参数、封装参数在P52
电气规格在P49P50P51P52P53P54P55P56P57P58P59P60
导航目录
STM32F091VBT6数据手册
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Package information STM32F091xB STM32F091xC
100/127 DocID026284 Rev 3
7 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
7.1 UFBGA100 package information
UFBGA100 is a 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra-fine-profile ball grid array
package.
Figure 33. UFBGA100 package outline
1. Drawing is not to scale.
Table 70. UFBGA100 package mechanical data
Symbol
millimeters inches
(1)
Min. Typ. Max. Min. Typ. Max.
A - - 0.600 - - 0.0236
A1 - - 0.110 - - 0.0043
A2 - 0.450 - - 0.0177 -
A3 - 0.130 - - 0.0051 0.0094
A4 - 0.320 - - 0.0126 -
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