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STM32F103R6T6 数据手册 - ST Microelectronics(意法半导体)
制造商:
ST Microelectronics(意法半导体)
分类:
微控制器
封装:
LQFP-64
描述:
性能线,基于ARM的32位MCU和Flash , USB , CAN , 7个16位定时器,2个ADC和9通信接口 Performance line, ARM-based 32-bit MCU with Flash, USB, CAN, seven 16-bit timers, two ADCs and nine communication interfaces
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P22P23P24P25P26P27P28Hot
典型应用电路图在P48P50P73
封装尺寸在P75P76P77P78P79P80P81P82P83P84P85P86
型号编码规则在P93P94P95
标记信息在P78P81P84P87P91
技术参数、封装参数在P32P55
电气规格在P30P31P32P33P34P35P36P37P38P39P40P41
导航目录
STM32F103R6T6数据手册
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DocID15060 Rev 7 79/99
STM32F103x4, STM32F103x6 Package information
98
6.2 UFQFPN48 package information
Figure 41. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
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