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器件3D模型￥ 9.649
UCC37322P 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
FET驱动器
封装:
DIP-8
描述:
TEXAS INSTRUMENTS UCC37322P 芯片, MOSFET, 低压侧, 4V-15V电源, 9A输出, 35ns延迟, DIP-8
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引脚图在P5Hot
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型号编码规则在P2
标记信息在P19P20P21
封装信息在P5P19P20P21P22P23P24
技术参数、封装参数在P2
应用领域在P1P22P31
电气规格在P3
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UCC37322P数据手册
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若手册格式错乱，请下载阅览PDF原文件
UCC27321 , UCC27322
UCC37321, UCC37322
SLUS504G –SEPTEMBER 2002–REVISED MAY 2013
www.ti.com
DESCRIPTION (CONTINUED)
Using a design that inherently minimizes shoot-through current, the outputs of these can provide high gate drive
current where it is most needed at the Miller plateau region during the MOSFET switching transition. A unique
hybrid output stage paralleling bipolar and MOSFET transistors (TrueDrive) allows efficient current delivery at low
supply voltages.With this drive architecture, UCC37321/2/3 can be used in industry standard 6-A, 9-A and many
12-A driver applications. Latch up and ESD protection circuitries are also included. Finally, the UCC37321/2
provides an enable (ENBL) function to have better control of the operation of the driver applications. ENBL is
implemented on pin 3 which was previously left unused in the industry standard pin-out. It is internally pulled up
to Vdd for active high logic and can be left open for standard operation.
In addition to SOIC-8 (D) and PDIP-8 (P) package offerings, the UCC37321/2 also comes in the thermally
enhanced but tiny 8-pin MSOP PowerPAD™ (DGN) package. The PowerPAD™ package drastically lowers the
thermal resistance to extend the temperature operation range and improve the long-term reliability.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)(2)
UCCx732x UNIT
Supply voltage, V
DD
-–0.3 to 16 V
Output current (OUT) DC, I
OUT_DC
0.6 A
–0.3 V to 6 V or V
DD
+0.3
Input voltage (IN), V
IN
(whichever is larger)
V
–0.3 V to 6 V or V
DD
+0.3
Enable voltage (ENBL)
(whichever is larger)
D package 650 mW
Power dissipation at T
A
= 25°C DGN package 3 W
P package 350 mW
Junction operating temperature, T
J
–55 to 150 °C
Storage temperature, T
stg
–65 to 150 °C
Lead temperature (soldering, 10 sec.) 300 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal.
ORDERING INFORMATION
PACKAGED DEVICES
OUTPUT TEMPERATURE
MSOP-8 PowerPAD
CONFIGURATION RANGE T
A
= T
J
SOIC-8 (D)
(1)
PDIP-8 (P)
(DGN)
(1)
–40°C to +105°C UCC27321D UCC27321DGN UCC27321P
Inverting
0°C to +70°C UCC37321D UCC37321DGN UCC37321P
–40°C to +105°C UCC27322D UCC27322DGN UCC27322P
NonInverting
0°C to +70°C UCC37322D UCC37322DGN UCC37322P
(1) D (SOIC–8) and DGN (PowerPAD–MSOP) packages are available taped and reeled. Add R suffix to device type (e.g. UCC37321DR,
UCC37322DGNR) to order quantities of 2,500 devices per reel.
2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: UCC27321 UCC27322 UCC37321 UCC37322
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