Datasheet 搜索 > 存储芯片 > Microchip（微芯） > AT24C01C-SSHM-T 数据手册 > AT24C01C-SSHM-T 产品修订记录 1/5 页
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AT24C01C-SSHM-T 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
存储芯片
封装:
SOIC-8
描述:
1-Kbit(128 x 8bit)，I2C接口，工作电压：1.7V to 5.5V
Pictures:
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符号图
焊盘图
引脚图
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封装信息在P2
型号编号列表在P5
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AT24C01C-SSHM-T数据手册
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of 5 Go
若手册格式错乱，请下载阅览PDF原文件
Page 1 of 4
Product Change Notification / LIAL-12WRCV778
Date:
19-Jan-2021
Product Category:
Memory
PCN Type:
Manufacturing Change
Notification Subject:
CCB 2927.001 and CCB 3280.002 Final Notice: Qualification of MTAI as an additional assembly and final
test site for selected Atmel AT24C0xC, AT24C128C, AT24C16C, AT24C256C, AT24C32D and AT24C64D
device families available in 8L SOIC package.
Affected CPNs:
LIAL-12WRCV778_Affected_CPN_01192021.pdf
LIAL-12WRCV778_Affected_CPN_01192021.csv
Notification Text:
PCN Status: Final notification
PCN Type: Manufacturing Change
Microchip Parts Affected:Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xC,
AT24C128C, AT24C16C, AT24C256C, AT24C32D and AT24C64D device families available in 8L SOIC package.
Pre Change:
Assembled at ANAP assembly site using palladium coated copper (PdCu) bond wire, 8290 die attach and G700A mold
compound material with NiPdAu lead plating in 60 x 60 mils paddle size without lead lock.orAssembled at ASSH assembly
site using palladium coated copper (PdCu) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire,
EN-4900G die attach and G700LY molding compound or CEL-9240HF10AK mold compound material with NiPdAu or Matte
tin lead plating in 93 x 93 mils paddle size without lead lock.
and
Tested at ASSH or ANAP Final Test site.
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