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Datasheet 搜索 > 存储芯片 > Microchip(微芯) > AT24C01C-SSHM-T 数据手册 > AT24C01C-SSHM-T 产品修订记录 2/5 页
AT24C01C-SSHM-T
器件3D模型
¥ 0.811
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  • 封装信息在P2
  • 型号编号列表在P5
AT24C01C-SSHM-T数据手册
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Post Change:Assembled at ANAP assembly site using palladium coated copper (PdCu) bond wire, 8290 die attach and
G700A mold compound material with NiPdAu lead plating in 60 x 60 mils paddle size without lead lockorAssembled at
ASSH assembly site using palladium coated copper (PdCu) bond wire or palladium coated copper with gold flash (CuPdAu)
bond wire, EN-4900G die attach and G700LY molding compound or CEL-9240HF10AK mold compound material with NiPdAu
or Matte tin lead plating in 93 x 93 mils paddle size without lead lock.
or
Assembled at MTAI assembly site using gold (Au)
bond wire, 8390A die attach and G600V mold compound material with Matte tin lead plating in 90 x 90 mils paddle size
with lead lock.andTested at ASSH, ANAP or MTAI Final Test site.
Pre and Post Change Summary:
Pre Change
Post Change
Assembly Site
Amkor
Technology
Philippines
(P1/P2), INC.
(ANAP)
ASE Advanced
Semiconductor
(Shanghai) Co., Ltd.
(ASSH)
Amkor Technology
Philippines (P1/P2),
INC. (ANAP)
ASE Advanced
Semiconductor
(Shanghai) Co., Ltd.
(ASSH)
Microchip
Technology
Thailand
(HQ) (MTAI)
Wire material
PdCu
CuPdAu
PdCu
PdCu
CuPdAu
Au
Die attach
material
8290
EN-4900G
8290
EN-4900G
8390A
Molding
compound
material
G700A
CEL-9240HF
10AK
G700A
G700LY
CEL-9240HF
10AK
G600V
Lead frame
material
CDA194
CDA194
CDA194
CDA194
CDA194
Paddle size
60 x 60 mils
93 x 93 mils
60 x 60 mils
93 x 93 mils
90 x 90 mils
Lead Lock
No
No
No
No
Yes
Lead Plating
NiPdAu
Matte tin
NiPdAu
NiPdAu
Matte tin
Matte Tin
Pre Change
Post Change
Final Test Site
ASE Advanced
Semiconductor
(Shanghai) Co.,
Ltd. (ASSH)
Amkor
Technology
Philippines
(P1/P2), INC.
(ANAP)
ASE Advanced
Semiconductor
(Shanghai) Co.,
Ltd. (ASSH)
Amkor Technology
Philippines (P1/P2),
INC. (ANAP)
Microchip
Technology
Thailand (MTAI)
Base
Quantity
Multiple
(BQM)
Tube
100
100
100
100
100
Tape and
Reel
4000
4000
4000
4000
4000
Pin1
Orientation
Tube
Pin 1 side (Black)
Not Applicable
Pin 1 side (Black)
Not Applicable
Pin 1 side (White)
Tape and
Reel
Quadrant 1
Quadrant 1
Quadrant 1
Quadrant 1
Quadrant 1

AT24C01C-SSHM-T 数据手册

Microchip(微芯)
23 页 / 0.93 MByte
Microchip(微芯)
140 页 / 1.53 MByte
Microchip(微芯)
5 页 / 0.05 MByte

AT24C01 数据手册

ATMEL(爱特美尔)
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1-Kbit(128 x 8bit),I2C接口,工作电压:1.7V to 5.5V
Microchip(微芯)
Microchip(微芯)
EEPROM, 串行I2C (2-线), 1 Kbit, 128 x 8位, 100 kHz, SOIC, 8 引脚
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AT24C01D 系列 1 Kb (128 x 8) 1.7 V I2C 兼容 串行 EEPROM - SOIC-8
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PROM 串行存取,Atmel### EEPROM 串行存取 - Atmel
Microchip(微芯)
电可擦除可编程只读存储器 1K 2-WIRE 5 SOT23 PB/HALO FREE, 1.7V
Microchip(微芯)
EEPROM, 串行I2C (2-线), 1 Kbit, 128 x 8位, 1 MHz, TSSOP, 8 引脚
ATMEL(爱特美尔)
ATMEL  AT24C01B-PU  EEPROM, 1 Kbit, 128 x 8位, 1 MHz, 串行, DIP, 8 引脚
ATMEL(爱特美尔)
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