Datasheet 搜索 > MOS管 > TI（德州仪器） > CSD16325Q5 数据手册 > CSD16325Q5 产品修订记录 4/5 页
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CSD16325Q5 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
MOS管
封装:
8-VSON-CLIP
描述:
N 通道 NexFET™ 功率 MOSFET
Pictures:
3D模型
符号图
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CSD16325Q5数据手册
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of 5 Go
若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN#20140523000
Qualification Data – Approved May, 2014
This qualification has been specifically developed for the validation of this change. The qualification data
validates that the proposed change meets the applicable released technical specifications.
Reference Qualification# 1 : CSD87331Q3D (MSL 1-260C)
Package Construction Details
Assembly Site:
PAC
Mold Compound:
SID#200805
# Pins-Designator, Family:
8-DQZ, LSON-CLIP
Mount Solder:
SID#200757
Lead frame (Finish, Base):
Matte Sn, Cu
Bond Wire:
1.0 Mil Dia., Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size/Fail
**T/C -40C/125C
-40C/+125C (500 Cyc)
77/0
Notes **- Preconditioning sequence: Level 1-260C.
Qualification Data – Approved May, 2014
This qualification has been specifically developed for the validation of this change. The qualification data
validates that the proposed change meets the applicable released technical specifications.
Reference Qualification# 2 : CSD58869Q5D (MSL 1-260C)
Package Construction Details
Assembly Site:
PAC
Mold Compound:
SID#202828
# Pins-Designator, Family:
8-DQY, LSON-CLIP
Mount Solder:
SID#200757
Lead frame (Finish, Base):
Matte Sn, Cu
Bond Wire:
1.0 Mil Dia., Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size/Fail
**T/C -40C/125C
-40C/+125C (500 Cyc)
77/0
Notes **- Preconditioning sequence: Level 1-260C.
Qualification Data – Approved May, 2014
This qualification has been specifically developed for the validation of this change. The qualification data
validates that the proposed change meets the applicable released technical specifications.
Reference Qualification# 3 : CSD16407Q5 (MSL 1-260C)
Package Construction Details
Assembly Site:
PAC
Mold Compound:
SID#202828
# Pins-Designator, Family:
8-DQH, LSON-CLIP
Mount Solder:
SID#200757
Lead frame (Finish, Base):
Matte Sn, Cu
Bond Wire:
1.0 Mil Dia., Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size/Fail
**T/C -40C/125C
-40C/+125C (500 Cyc)
77/0
Notes **- Preconditioning sequence: Level 1-260C.
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