Datasheet 搜索 > 双极性晶体管 > ROHM Semiconductor（罗姆半导体） > DTC123EETL 数据手册 > DTC123EETL 其他数据使用手册 1/5 页
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DTC123EETL 其他数据使用手册 - ROHM Semiconductor（罗姆半导体）
制造商:
ROHM Semiconductor（罗姆半导体）
分类:
双极性晶体管
封装:
SOT-416-3
描述:
DTC123EETL 编带
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
标记信息在P3
封装信息在P3
导航目录
DTC123EETL数据手册
Page:
of 5 Go
若手册格式错乱，请下载阅览PDF原文件
Tape and Packing
1. Components description (Only for reference)
2. Taping dimensions
Note) Feed holes might be cover with the adhesive tape, but nothing will affect for using by that.
3. Tape and packing specification
3-1. Direction of tape winding
Connection (3) comes to feeding hole side. The direction shall be one in a reel.
3-2. Cumulative pitch tolerance
The cumulative pitch tolerance of the mold for producing the carrier tape shall be within ±0.2mm
per 10pitches.
3-3. The minimum radius to bend the carrier tape
Carrier tape shall be flexible enough to protect from no component and damage under a minimum
radius of 30mm. However it shall be defined only inside of carrier tape．
3-4. The material of carrier tape
Special carbon paints are coated both sides of polystyrene.
3-5. Failure Rate
Type
TL
Discontinuous missing
Product
Package
Transistor / MOSFET
Continuous missing
Remark
Except leader and trail portion
SOT-416 (EMT3)
Incidence
0%
Max.0.1%／reel
Unit ： mm
1.6
1.6
0.8
0.2
0.15
0.7
2.0±0.05
4.0±0.1
4.0±0.1
1.8±0.08
Φ0.5±0.1
0.9±0.2
0.3±0.1
8.0±0.2
3.5±0.05
1.8±0.08
1.75±0.1
5.5±0.2
0～0.5
Φ1.5
+0.1
-0
Unit : mm
(2)
(3)
(1)
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2016.1 - Rev.A
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