Datasheet 搜索 > 双极性晶体管 > ROHM Semiconductor(罗姆半导体) > DTC123EETL 数据手册 > DTC123EETL 其他数据使用手册 4/5 页

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DTC123EETL 其他数据使用手册 - ROHM Semiconductor(罗姆半导体)
制造商:
ROHM Semiconductor(罗姆半导体)
分类:
双极性晶体管
封装:
SOT-416-3
描述:
DTC123EETL 编带
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
标记信息在P3
封装信息在P3
导航目录
DTC123EETL数据手册
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若手册格式错乱,请下载阅览PDF原文件

SOT-416(EMT3) Tape Packing:TL
10. Taping Peeling Strength
Peeling strength : 0.1N~1.0N (If products have stored over our recommended storage condition.)
【Test condition (Based on JIS C 0806-3)】
Pull direction at angle from 165°to 180°and pull the seal tape with the speed of 300mm/min±10mm/min.
11. Recommended storage condition
Recommended storage condition :
Temperature 5℃ - 40℃, Humidity 30%RH - 80%RH
Recommended storage time period :
・Dipped SMD products (Sn3Ag0.5Cu) : One year after production
・Plated SMD products (Sn2Cu or Sn100%) : Five years after production
Notes) It is strongly recommended to confirm solderability before using products of which storage time
is exceeding recommended storage time period.
12. Package
Seal tape
165°~ 180°
Pull Direction
Emboss Carrier
408mm
185mm
530mm
209mm
193mm
255mm
193mm
185mm
60mm
Attached position of packing slip
Max.5reel
(Max.3kpcs
×
5reel
=
15kpcs)
(Max.15kpcs×4box=60kpcs)
Attached position of packing slip
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4/4
2016.1 - Rev.A
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