Datasheet 搜索 > FPGA芯片 > Altera（阿尔特拉） > EP1C20F324C8 数据手册 > EP1C20F324C8 产品修订记录 1/6 页
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EP1C20F324C8 产品修订记录 - Altera（阿尔特拉）
制造商:
Altera（阿尔特拉）
分类:
FPGA芯片
封装:
FBGA-324
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EP1C20F324C8数据手册
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Altera Corporation 10/14/2008 PCN0813
P
P
R
R
O
O
C
C
E
E
S
S
S
S
C
C
H
H
A
A
N
N
G
G
E
E
N
N
O
O
T
T
I
I
F
F
I
I
C
C
A
A
T
T
I
I
O
O
N
N
P
P
C
C
N
N
0
0
8
8
1
1
3
3
POLYIMIDE WAFER COAT REMOVAL FOR SELECTED
ALTERA DEVICES
Change Description
Altera is implementing a change to the wafer coat on selected product lines fabricated at Taiwan
Semiconductor Manufacturing Co. (TSMC). This change includes the exclusion of the existing
polyimide wafer coat for the Cyclone
®
FPGA, Cyclone
II FPGA, MAX
®
II CPLD, and Stratix
®
FPGA product families.
Recommended Action
No action is required as a result of this change.
Reason for Change
Altera is implementing this change in order to be consistent with the current wafer-fabrication
practices. Historically, polyimide coat has been used to reduce mechanical stress between the top
surface of the die and the package mold compound. With current technologies, the die surface to
package mold compound interface is robust, therefore eliminating the need for the polyimide
coating. This change is fully qualified and the data is included in this PCN. Products assembled
with the non-polyimide coated wafers meet Altera’s high quality and reliability requirements. By
being more consistent with current wafer-fabrication practices, this change also improves the
availability of supply and the overall product life.
Products Affected
The product lines affected by this change are listed in Table 1. A list of ordering part numbers is
included in Appendix 1. The products will transition to the non-polyimide wafers as the current
inventory is consumed.
Revision: 1.0.0
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