Datasheet 搜索 > 运算放大器 > TI（德州仪器） > LMC6061IMX/NOPB 数据手册 > LMC6061IMX/NOPB 其他数据使用手册 3/4 页
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LMC6061IMX/NOPB 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
运算放大器
封装:
SOIC-8
描述:
精密 CMOS 单路微功耗运算放大器 8-SOIC -40 to 85
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LMC6061IMX/NOPB数据手册
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若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN# 20160321001
LM336BM-2.5/NOPB
LM5109MAX/NOPB
LMC6462AIM/NOPB
Qualification Report
SOIC 8L- D package with SID# 101380756 Mold Compound at subcon AP1
Approve Date 16-Mar-2016
Product Attributes
Attributes
Qual Device:
LM4808MX/NOPB
Qual Device:
LMC7660IMXNOPB
QBS Package
Reference:
LM324ADR
QBS Package
Reference:
LM358DR
QBS Package
Reference:
LM393DR
Assembly Site
AMKOR P1
AMKOR P1
AMKOR P1
AMKOR AP1
AMKOR AP1
Package Family
SOIC
SOIC
SOIC
SOIC
SOIC
Flammability
Rating
UL 94 V-0
UL 94 V-0
UL 94 V-0
UL 94 V-0
UL 94 V-0
Wafer Fab
Supplier
MAINEFAB
GFAB 6
SFAB
SFAB
SFAB
Wafer Process
CS065SP
CMMGATE.8.1
JI1
JI1
JI1
- QBS: Qual By Similarity
- Qual Devices qualified at LEVEL1-260C: LMC7660IMXNOPB, LM4808MX/NOPB
Qualification Results
Data Displayed as: Number of lots / Total sample size / Total failed
Type
Test Name / Condition
Duration
Qual Device:
LM4808MX/NOPB
Qual Device:
LMC7660IMXNOPB
AC
Autoclave 121C
96 Hours
-
3/231/0
HTSL
High Temp. Storage Bake, 170C
420 Hours
-
3/231/0
DS
Die Shear
--
1/10/0
3/30/0
FLAM
Flammability (IEC 695-2-2)
--
-
-
FLAM
Flammability (UL 94V-0)
--
-
-
FLAM
Flammability (UL-1694)
--
-
-
HAST
Biased HAST, 130C/85%RH
96 Hours
-
-
HTOL
Life Test, 150C
300 Hours
-
-
LI
Lead Fatigue
Leads
1/22/0
-
LI
Lead Pull to Destruction
Leads
1/22/0
-
LI
Lead Finish Adhesion
Leads
-
-
MISC
Salt Atmosphere
Salt Atmosphere
-
-
PD
Physical Dimensions
--
-
3/15/0
SD
Solderability
8 Hours Steam Age
-
3/66/0
TC
Temperature Cycle, -65C/150C
500 Cycles
1/77/0
3/231/0
WBP
Bond Pull
Wires
1/30/0
3/90/0
WBS
Ball Bond Shear
Wires
1/30/0
3/90/0
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