Datasheet 搜索 > DC/DC转换器 > TI（德州仪器） > LMZ31704RVQR 数据手册 > LMZ31704RVQR 其他数据使用手册 1/32 页
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LMZ31704RVQR 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DC/DC转换器
封装:
QFN-42
描述:
4A SIMPLE SWITCHER®电源模块具有2.95V - 17V输入和电流共享的QFN封装 4A SIMPLE SWITCHER® Power Module with 2.95V-17V Input and Current Sharing in QFN Package
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LMZ31704RVQR数据手册
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若手册格式错乱，请下载阅览PDF原文件
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMZ31704
SLVSBV8B –JUNE 2013–REVISED JUNE 2017
LMZ31704 4A SIMPLE SWITCHER
®
Power Module With 2.95-V to 17-V Input and
Current Sharing in QFN Package
1
1 Features
1
• Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design
• 10mm x 10mm x 4.3mm package
– Pin Compatible with LMZ31710 & LMZ31707
• Efficiencies Up To 95%
• Eco-mode™ / Light Load Efficiency (LLE)
• Wide-Output Voltage Adjust
0.6 V to 5.5 V, with 1% Reference Accuracy
• Supports Parallel Operation for Higher Current
• Optional Split Power Rail Allows
Input Voltages Down to 2.95 V
• Adjustable Switching Frequency
(200 kHz to 1.2 MHz)
• Synchronizes to an External Clock
• Provides 180° out-of-phase Clock Signal
• Adjustable Slow-Start
• Output Voltage Sequencing / Tracking
• Power Good Output
• Programmable Undervoltage Lockout (UVLO)
• Overcurrent and Overtemperature Protection
• Pre-bias Output Start-up
• Operating Temperature Range: –40°C to 85°C
• Enhanced Thermal Performance: 13.3°C/W
• Meets EN55022 Class B Emissions
– Integrated Shielded Inductor
2 Applications
• Broadband & Communications Infrastructure
• Automated Test and Medical Equipment
• Compact PCI / PCI Express / PXI Express
• DSP and FPGA Point-of-Load Applications
3 Description
The LMZ31704 SIMPLE SWITCHER power module
is an easy-to-use integrated power solution that
combines a 4-A DC/DC converter with power
MOSFETs, a shielded inductor, and passives into a
low profile, QFN package. This total power solution
allows as few as three external components and
eliminates the loop compensation and magnetics part
selection process.
The 10x10x4.3 mm QFN package is easy to solder
onto a printed circuit board and allows a compact
point-of-load design. Achieves greater than 95%
efficiency and excellent power dissipation capability
with a thermal impedance of 13.3°C/W. The
LMZ31704 offers the flexibility and the feature-set of
a discrete point-of-load design and is ideal for
powering a wide range of ICs and systems.
Advanced packaging technology affords a robust and
reliable power solution compatible with standard QFN
mounting and testing techniques.
Simplified Application
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