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MC68302AG16C 其他数据使用手册 - NXP(恩智浦)
制造商:
NXP(恩智浦)
分类:
微处理器
封装:
LQFP-144
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
焊接温度在P23P29
导航目录
MC68302AG16C数据手册
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property of their respective owners. © Freescale Semiconductor, Inc. 2008. The information provided is typical to the industry and is not intended to represent
actual practice at Freescale.
Presentation Outline
PBGA Introduction and Package Description
PC Board Design for PBGA
PBGA Assembly
PBGA Solder Joint Voids
Rework
Solder Joint Reliability
Thermal Performance
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