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MC68302AG16C 其他数据使用手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
微处理器
封装:
LQFP-144
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
焊接温度在P23P29
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MC68302AG16C数据手册
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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc in the US and other countries. All other product or service names are the
property of their respective owners. © Freescale Semiconductor, Inc. 2008. The information provided is typical to the industry and is not intended to represent
actual practice at Freescale.
Substrate with
Soldermask
Epoxy Overmold
Routing Vias
Solder Sphere
Silicon Die
Die Attach
Au Bond Wires
Ball Pitch
Motherboard
Solder Pads (PBGA Package Pads
- PCB Pad)
Joint Stand-Off
(Varies with Pad
Sizes, Sphere
Sizes and Solder
Paste Volume)
PBGA BGA Construction
Thermal and/or
Ground Vias
PBGA Introduction and Package Description
“MAP” Style
PBGA Molded
to Substrate Edge
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