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MC9S08JM32CGT 产品封装文件 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
微控制器
封装:
QFN-48
描述:
NXP MC9S08JM32CGT 芯片, 微控制器, 8位, S08, 32K闪存, QFN48
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P25P26P27P28P29P30P31P32P66P79P121P250Hot
典型应用电路图在P23
原理图在P21P22P80P122P123P124P130P131P132P138P139P140
封装尺寸在P1P375
型号编码规则在P375
功能描述在P126P134P149P171P181P190P216P223P233P234P235P254
技术参数、封装参数在P308P351P352P359P363P364P371
应用领域在P229
电气规格在P23P77P197P241P351P352P353P354P355P356P357P358
导航目录
MC9S08JM32CGT数据手册
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Freescale Semiconductor
Addendum
Document Number: QFN_Addendum
Rev. 0, 07/2014
© Freescale Semiconductor, Inc., 2014. All rights reserved.
This addendum provides the changes to the 98A case outline numbers for products covered in this book.
Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
the table below for the old (gold wire) package versus the new (copper wire) package.
To view the new drawing, go to Freescale.com and search on the new 98A package number for your
device.
For more information about QFN package use, see EB806: Electrical Connection Recommendations for
the Exposed Pad on QFN and DFN Packages.
Addendum for New QFN
Package Migration
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