Datasheet 搜索 > NXP（恩智浦） > MCIMX287CVM4C 数据手册 > MCIMX287CVM4C 其他数据使用手册 1/74 页
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MCIMX287CVM4C 其他数据使用手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
封装:
MAPBGA-289
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
原理图在P5
封装尺寸在P11P59P60P61P62P63P64P65P66P67P68P69
型号编码规则在P3
技术参数、封装参数在P11P12P27P29P44
应用领域在P2P3P4P5P6P7P8P9P10P11P12P13
电气规格在P11P12P13P14P15P16P17P18P19P20P21P22
型号编号列表在P11
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MCIMX287CVM4C数据手册
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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX28CEC
Rev. 3, 07/2012
© 2012 Freescale Semiconductor, Inc. All rights reserved.
i.MX28
Package Information
Plastic package
Case MAPBGA-289, 14 x 14 mm, 0.8 mm pitch
Ordering Information
See Ta ble 1 on page 3 for ordering information.
1 Introduction
The i.MX28 is a low-power, high-performance
applications processor optimized for the general
embedded industrial and consumer markets. The core of
the i.MX28 is Freescale's fast, power-efficient
implementation of the ARM926EJ-S™ core, with
speeds of up to 454 MHz.
The device is suitable for a wide range of applications,
including the following:
• Human-machine interface (HMI) panels:
industrial, home
• Industrial drive, PLC, I/O control display, factory
robotics display, graphical remote controls
• Handheld scanners and printers
• Patient-monitoring, portable medical devices
• Smart energy meters, energy gateways
• Media phones, media gateways
The integrated power management unit (PMU) on the
i.MX28 is composed of a triple output DC-DC switching
converter and multiple linear regulators. These provide
power sequencing for the device and its I/O peripherals
i.MX28 Applications
Processors for Consumer
Products
Silicon Version 1.2
Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Device Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering Information and Functional Part Differences
3
1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . 11
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX28 Device-Level Conditions . . . . . . . . . . . . . . 11
3.2. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 18
3.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 19
3.4. I/O AC Timing and Parameters . . . . . . . . . . . . . . 23
3.5. Module Timing and Electrical Parameters . . . . . . 27
4. Package Information and Contact Assignments . . . . . . 59
4.1. Case MAPBGA-289, 14 x 14 mm, 0.8 mm Pitch . 59
4.2. Ground, Power, Sense, and Reference Contact
Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.3. Signal Contact Assignments . . . . . . . . . . . . . . . . 61
4.4. i.MX280 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.5. i.MX283 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 65
4.6. i.MX286 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 67
4.7. i.MX287 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 69
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
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