Datasheet 搜索 > 微控制器 > TI（德州仪器） > MSP430F2132IRHBR 数据手册 > MSP430F2132IRHBR 产品修订记录 4/10 页
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MSP430F2132IRHBR 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
微控制器
封装:
VQFN-32
描述:
TEXAS INSTRUMENTS MSP430F2132IRHBR 芯片, 微控制器, 16位 , MSP430, 16MHz, QFN-32
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MSP430F2132IRHBR数据手册
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Texas Instruments, Inc. PCN# 20141204000
PCN Number:
20141204000
PCN Date:
12/16/2014
Title:
Qualification of TI Chengdu (CDAT) as Additional Assembly and Test Site for Select
VQFN/WQFN Package Devices
Customer Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality Services
Proposed 1
st
Ship Date:
03/16/2015
Estimated Sample
Availability:
Date Provided at Sample
request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments Incorporated is announcing the qualification of TI Chengdu (CDAT) as
Additional Assembly and Test Site for select devices listed in the “Product Affected” Section.
Current assembly sites are as follows.
Existing Sites
Additional Site
Assembly/Test Sites
TI-CLARK, CARZ, NSE
CDAT
Test coverage, insertions, conditions will remain consistent with current testing and verified with
test MQ.
Reason for Change:
Continuity of supply.
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
ASSEMBLY SITE CODES: TI-CLARK = I , CARZ = F , NSE = J, CDAT = 8
Sample product shipping label (not actual product label)
Assembly Site
TI-CLARK
Assembly Site Origin (22L)
ASO: QAB
CARZ
Assembly Site Origin (22L)
ASO: CSZ
NSE
Assembly Site Origin (22L)
ASO: NSE
TI Chengdu (CDAT)
Assembly Site Origin (22L)
ASO: CDA
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