Datasheet 搜索 > 微控制器 > TI（德州仪器） > MSP430F2132IRHBR 数据手册 > MSP430F2132IRHBR 产品修订记录 6/10 页
器件3D模型￥ 5.436
MSP430F2132IRHBR 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
微控制器
封装:
VQFN-32
描述:
TEXAS INSTRUMENTS MSP430F2132IRHBR 芯片, 微控制器, 16位 , MSP430, 16MHz, QFN-32
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P7P8P9
导航目录
MSP430F2132IRHBR数据手册
Page:
of 10 Go
若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN# 20141204000
Group 1: Qualification Status Report
Chengdu A/T Qualification of VQFN/VSON packages
Product Attributes
Attributes
Qual Device 1:
BQ24196RGER
Qual Device 2:
TPS40192DRCR
Qual Device: 3
TPS51200DRCR
Qual Device 4:
TPS51622RSMR
Assembly Site
CHENGDU A/T
CHENGDU A/T
CHENGDU A/T
CHENGDU A/T
Package Family
VQFN
VSON
VSON
VQFN
Die Attributes
Die Revision
A
A
B
A
Wafer Fab Site
RFAB
DFAB 200MM
RFAB
RFAB
Wafer Fab Process
LBC7
LBC4
LBC7
LBC7
Package Attributes
Package
Designator
RGE
DRC
DRC
RSM
Package Size (mils)
157.48 X 157.48
118.11 X 118.11
118.11 X 118.11
157.48 X 157.48
Body Thickness
(mils)
35.43
35.43
35.43
35.43
Pin Count
24
10
10
32
Lead Frame
Material
Cu
Cu
Cu
Cu
Lead Finish
NIPDAU
NiPdAu
NiPdAu
NiPdAu
Lead Pitch (mils)
19.68
19.68
19.68
15.75
Mount Compound
4207123
4207768
4207768
4207768
Mold Compound
4208625
4208625
4208625
4208625
Bond Wire
Composition
Cu
Cu
Cu
Cu
Bond Wire
Diameter (mils)
1.98
0.96
0.96
0.96
Flammability
Rating
UL 94 V-0
UL 94 V-0
UL 94 V-0
UL 94 V-0
Attributes
Qual Device 5:
TPS62140RGTR
Qual Device 6:
TPS65262RHBR
Qual Device 7:
TPS7A8001DRBR
Qual Device 8:
MSP430G2553IRHB
Assembly Site
CHENGDU A/T
CHENGDU A/T
CHENGDU A/T
CHENGDU A/T
Package Family
VQFN
VQFN
VSON
VQFN
Die Attributes
Die Revision
F
A2
A
C
Wafer Fab Site
MIHO8
RFAB
RFAB
TSMC FAB 10
Wafer Fab Process
LBC7
LBC7
LBC7
TSMC.035 EMB FLASH
Package Attributes
Package
Designator
RGT
RHB
DRB
RHB
Package Size (mils)
118.11 X 118.11
196.85 X 196.85
118.11 X 118.11
196.85 X 196.85
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
