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器件3D模型￥ 15.08
MSP430F5510IPTR 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
微控制器
封装:
LQFP-48
描述:
混合信号微控制器 MIXED SIGNAL MICROCONTROLLER
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P8P76P78P79P80P81P83P85P87P91Hot
原理图在P75
封装尺寸在P7P104P105P106P108P109P110
标记信息在P100P104P105P106P107
封装信息在P7P21P100P104P105P106P107P108P109P110
技术参数、封装参数在P17P18P19P20P21P22P23P24P25P26P27P28
导航目录
MSP430F5510IPTR数据手册
Page:
of 119 Go
若手册格式错乱，请下载阅览PDF原文件
MSP430F5510
,
MSP430F5509
,
MSP430F5508
MSP430F5507
,
MSP430F5506
,
MSP430F5505
,
MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
ZHCS897J –JULY 2009–REVISED APRIL 2015
www.ti.com.cn
2 修修订订历历史史记记录录
Changes from Revision I (November 2013) to Revision J Page
• 已通篇更改格式和布局，其中包括添加章节编号.................................................................................. 1
• 添加了
器件信息
表..................................................................................................................... 2
• 添加了节 1.4并将所有功能框图移到这里........................................................................................... 2
• 更改了图 1-2 以显示两个 USCI 并添加了信号接入限制的相关注释 ............................................................ 3
• Added Section 3 and moved Table 3-1 to it....................................................................................... 7
• For 48-pin options on F5510, F5509, and F5508, changed to two USCIs with note about port mapping limitations. .. 7
• Added "with port interrupt" to P2.7 description.................................................................................. 14
• Added Section 5 and moved all electrical specifications to it ................................................................. 17
• Added Section 5.2, ESD Ratings.................................................................................................. 17
• Moved Section 5.6, Thermal Characteristics ................................................................................... 21
• Changed the TYP value of C
L,eff
with Test Conditions of "XTS = 0, XCAPx = 0" from 2 pF to 1 pF..................... 26
• Added "C
VeREF+
= 20 pF" to Test Conditions for E
I
.............................................................................. 40
• In Test Conditions for E
D
, E
O
, E
G
, and E
T
: changed from "(V
eREF+
– V
eREF–
)min ≤ (V
eREF+
– V
eREF–
)" to
"1.4 V ≤ (V
eREF+
– V
eREF–
)"; changed from "C
VREF+
" to "C
VeREF+
" .............................................................. 40
• Added "ADC10SREFx = 11b" to Test Conditions for E
G
and E
T
.............................................................. 40
• Changed MIN value of AV
CC(min)
with Test Conditions of "REFVSEL = {0} for 1.5 V" from 2.2 V to 1.8 V .............. 41
• Changed the value of CBREFACC in both Test Conditions for I
AVCC_REF
; changed first row from 0 to 1; changed
second row from 1 to 0............................................................................................................. 42
• Changed P5.3 figure (added P5SEL.2 and XT2BYPASS inputs with AND and OR gates)............................... 83
• Changed P5SEL.3 column from X to 0 for "P5.3 (I/O)" rows.................................................................. 83
• Changed P5.5 figure (added P5SEL.5 input and OR gate) ................................................................... 85
• Changed P5SEL.5 column from X to 0 for "P5.5 (I/O)" rows.................................................................. 85
• Added ZQE and PT packages to Table 6-57 header row ..................................................................... 92
• In Table 6-58, removed second USCI and corrected first USCI device descriptor value.................................. 95
• 添加了节 7，将
工具支持
、
器件命名规则
、ESD
注意事项
和
商标
部分移动到这里.......................................... 98
• 增加了节 8 ......................................................................................................................... 102
6
修订历史记录
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