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NRF24L01P-T 其他数据使用手册 - Nordic Semiconductor
制造商:
Nordic Semiconductor
分类:
射频接收器
封装:
QFN-20
描述:
NRF24L01+ 2.4GHz ISM 频段射频收发器**Nordic** **Semiconductor** **nRF24L01+** 是单芯片 2.4GHz 收发器，用于 ISM（工业、科学和医疗）无线电频段操作。 嵌入式基带协议引擎 (Enhanced ShockBurst™) 基于数据包通信，支持手动以及高级自主协议操作。射频频率范围：2.400 至 2.4835GHz ISM 频段，带 126 个频道 射频功率输出：高达 0dBm 接收器灵敏度：-94dBm @ 250kbps 调制：GFSK 最大 OTA 数据传输率：2Mbps Enhanced ShockBurst™ 硬件链路层支持 1 至 32 字节动态有效载荷长度 数据包组装/拆解 地址和 CRC 计算 自动 ACK 和重传 6 x 数据管道 MultiCeiver™，用于 1:6 星形网络 主机通信：串行 SPI 高达 10Mbps，Tx 和 Rx 为 32 字节 FIFO 电源：+1.9 至 +3.6V 直流 应用：无线 PC 外围设备、运动手表和传感器、射频远程控制，用于消费电子产品、家庭和商业自动化、有源 RFID、资产跟踪系统、超低功率传感器网络，用于物联网 (IoT) ### 单芯片组件，Nordic Semiconductor展开
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NRF24L01P-T数据手册
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Revision 1.0 Page 5 of 75
nRF24L01+ Preliminary Product Specification
7.5 Automatic packet transaction handling ................................................ 31
7.5.1 Auto Acknowledgement................................................................... 31
7.5.2 Auto Retransmission (ART)............................................................. 31
7.6 Enhanced ShockBurst flowcharts ........................................................ 33
7.6.1 PTX operation.................................................................................. 33
7.6.2 PRX operation ................................................................................. 35
7.7 MultiCeiver™........................................................................................ 37
7.8 Enhanced ShockBurst™ timing ........................................................... 40
7.9 Enhanced ShockBurst™ transaction diagram ..................................... 42
7.9.1 Single transaction with ACK packet and interrupts.......................... 42
7.9.2 Single transaction with a lost packet ............................................... 43
7.9.3 Single transaction with a lost ACK packet ....................................... 43
7.9.4 Single transaction with ACK payload packet ................................... 44
7.9.5 Single transaction with ACK payload packet and lost packet.......... 44
7. 9. 6 Tw o tra n s a ct io n s w i t h A C K p a y l oa d pac k et a n d t h e fi r st
ACK packet lost ........................................................................... 45
7.9.7 Two transactions where max retransmissions is reached ............... 45
7.10 Compatibility with ShockBurst™ .......................................................... 46
7.10.1 ShockBurst™ packet format............................................................ 46
8 Data and Control Interface ....................................................................... 47
8.1 Features ............................................................................................... 47
8.2 Functional description .......................................................................... 47
8.3 SPI operation ....................................................................................... 47
8.3.1 SPI Commands ............................................................................... 47
8.3.2 SPI timing ........................................................................................ 49
8.4 Data FIFO ............................................................................................ 52
8.5 Interrupt................................................................................................ 53
9 Register Map.............................................................................................. 54
9.1 Register map table ............................................................................... 54
10 Peripheral RF Information ........................................................................ 61
10.1 Antenna output..................................................................................... 61
10.2 Crystal oscillator................................................................................... 61
10.3 nRF24L01+ crystal sharing with an MCU............................................. 61
10.3.1 Crystal parameters .......................................................................... 61
10.3.2 Input crystal amplitude and current consumption ............................ 61
10.4 PCB layout and decoupling guidelines................................................. 62
11 Application example ................................................................................. 63
11.1 PCB layout examples........................................................................... 64
12 Mechanical specifications........................................................................ 68
13 Ordering information ................................................................................ 70
13.1 Package marking ................................................................................. 70
13.2 Abbreviations ....................................................................................... 70
13.3 Product options .................................................................................... 70
13.3.1 RF silicon......................................................................................... 70
13.3.2 Development tools........................................................................... 70
14 Glossary of Terms..................................................................................... 71
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