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NTCS0603E3103JLT
器件3D模型
0.741
导航目录
  • 型号编码规则在P1
  • 封装信息在P1P2
  • 焊接温度在P2
  • 功能描述在P6
  • 技术参数、封装参数在P2P6
  • 应用领域在P1
NTCS0603E3103JLT数据手册
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NTCS0603E3.....T
www.vishay.com
Vishay BCcomponents
Revision: 25-Feb-13
2
Document Number: 29056
For technical questions, contact: nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS in millimeters
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
Notes
(1)
Measured 0.3 mm above base pocket
(2)
P
0
pitch cumulative error over any 10 pitches ± 0.2 mm
T
L
1
W
L
2
L
3
L
4
L
1
WT
L
2
AND L
3
MIN.
L
4
MIN.
1.6 ± 0.15 0.8 ± 0.15 0.8 ± 0.15 0.2 0.4
Time (s)
0
50 100
150 200
200
250
100
150
Temperature (°C)
50
0
300
250
260 °C
245 °C
215 °C
180 °C
130 °C
2 K/s
40 s
10 s
10 s
Reflow Soldering
Lead (Pb)-free Reflow Solderin
g Profile
260 °C
245 °C
235 °C
170 °C
120 °C
2 K/s
max.
Time (s)
0
50 100
150 200
350
200
250
100
150
Temperature (°C)
50
0
300
40 s max.
60 s
20 s min.
normal
limit
250
300
6 K/s
max.
2.4
1.0
0.8
Recommended solder land pattern dimensions (mm)
F
W
P
0
P
2
D
0
B
0
A
0
P
1
E
1
JWB288
T
T
1
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER DIMENSION TOLERANCE
A
0
(1)
1.15 ± 0.1
B
0
(1)
1.9 ± 0.1
W8.0± 0.2
E
1
1.75 ± 0.1
F 3.5 ± 0.05
D
0
1.55 ± 0.05
P
0
(2)
4.0 ± 0.1
P
1
4.0 ± 0.1
P
2
2.0 ± 0.05
T tape thickness 1.1 Max.
T
1
cover tape < 0.1 -

NTCS0603E3103JLT 数据手册

VISHAY(威世)
7 页 / 0.14 MByte
VISHAY(威世)
7 页 / 0.12 MByte

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