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器件3D模型￥ 12.088
PIC16F15354-I/SP 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DIP-28
描述:
PIC 32MHz 闪存：4K@x14bit RAM：512Byte
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P5P13P14P15P16P17P18P20P207P313P454P455Hot
典型应用电路图在P455
原理图在P12P87P99P107P145P191P208P215P218P221P236P241
标记信息在P503P504
封装信息在P503P506P507P508P510P511P512P516
技术参数、封装参数在P102P117P140P141P146P219P228P253P254P477P482P483
应用领域在P81P85
电气规格在P117P140P141P146P219P228
导航目录
PIC16F15354-I/SP数据手册
Page:
of 518 Go
若手册格式错乱，请下载阅览PDF原文件
2016 Microchip Technology Inc. Preliminary DS40001853B-page 5
PIC16(L)F15354/55
PIN DIAGRAMS
PIC16(L)F15354
PIC16(L)F15355
1
2
3
4
5
6
7
8
9
10
VPP/MCLR/RE3
RA0
RA1
RA2
RA3
RA4
RA5
RB6/ICSPCLK
RB5
RB4
RB3
RB2
RB1
RB0
V
DD
VSS
11
12
13
14
15
16
17
18
19
20
28
27
26
25
24
23
22
21
V
SS
RA7
RA6
RC0
RC1
RC2
RC3
RC5
RC4
RC7
RC6
RB7/ICSPDAT
Note 1: See Table 2 for location of all peripheral functions.
2: All V
DD and all VSS pins must be connected at the circuit board level.
28-PIN PDIP, SOIC, SSOP
2
3
6
1
18
19
20
21
15
7
16
17
RC0
5
4
RB7/ICSPDAT
RB6/ICSPCLK
RB5
RB4
RB0
V
DD
VSS
RC7
RC6
RC5
RC4
RE3/MCLR
/VPP
RA0
RA1
RA2
RA3
RA4
RA5
V
SS
RA7
RA6
RC1
RC2
RC3
9
10
13
8
14
12
11
27
26
23
28
22
24
25
RB3
RB2
RB1
PIC16(L)F15354
PIC16(L)F15355
28-PIN UQFN (4x4), UQFN (6x6)
Note 1: See Table 3 for location of all peripheral functions.
2: All V
DD and all VSS pins must be connected at the circuit board level. Allowing one or more VSS or VDD pins to
float may result in degraded electrical performance or non-functionality.
3: The bottom pad of the QFN/UQFN package should be connected to V
SS at the circuit board level.
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